Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11628519 | Solder joint | Tetsu Takemasa, Tadashi Kosuga | 2023-04-18 |
| 11097379 | Solder bonding method and solder joint | Tetsu Takemasa, Tadashi Kosuga | 2021-08-24 |
| 10987764 | Flux and solder paste | Hiroyoshi Kawasaki, Masato Shiratori, Hiroaki Kawamata, Kazuhiro Minegishi | 2021-04-27 |
| 8227536 | Lead-free solder paste and its use | Shizuharu Watanabe, Hidekiyo Takaoka, Kosuke Nakano, Masafumi Seino | 2012-07-24 |