Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10994366 | Repair method and repair material | Satoshi Ishino, Yoshihiro Kawaguchi, Kosuke Nakano | 2021-05-04 |
| 10413992 | Method for joining structural material, joining sheet, and joint structure | Satoshi Ishino, Yoshihiro Kawaguchi, Kosuke Nakano, Wataru Yanase | 2019-09-17 |
| 10090268 | Method of forming solder bump, and solder bump | Yasuyuki Sekimoto, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima | 2018-10-02 |
| 10050355 | Conductive material, bonding method using the same, and bonded structure | Kosuke Nakano | 2018-08-14 |
| 10010980 | Solder paste, joining method using the same and joined structure | Kosuke Nakano | 2018-07-03 |
| 9691546 | Electronic part and method for forming joint structure of electronic part and joining object | Kosuke Nakano, Yutaka Ota, Kenichi Kawasaki | 2017-06-27 |
| 9614295 | Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part | Kosuke Nakano | 2017-04-04 |
| 9572255 | Electronic device, bonding material, and method for producing electronic device | Akihiro Nomura | 2017-02-14 |
| 9409247 | Joining method, method for producing electronic device and electronic part | Kosuke Nakano | 2016-08-09 |
| 9412517 | Electronic part | Kosuke Nakano, Yutaka Ota, Kenichi Kawasaki | 2016-08-09 |
| 9414513 | Electronic component module | Hideo Nakagoshi, Yoichi Takagi, Nobuaki Ogawa, Kosuke Nakono, Akihiko Kamada +1 more | 2016-08-09 |
| 9370111 | Ceramic multilayer substrate and method for producing the same | Yoshiko Okada, Osamu Chikagawa, Shodo Takei | 2016-06-14 |
| 9333593 | Joining method, joint structure and method for producing the same | Kosuke Nakano | 2016-05-10 |
| 9209527 | Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part | Kosuke Nakano | 2015-12-08 |
| 9162324 | Solder paste and solder joint | Kosuke Nakano, Minoru Ueshima | 2015-10-20 |
| 9113571 | Electronic component module and method for manufacturing the same | Hideo Nakagoshi, Yoichi Takagi, Nobuaki Ogawa, Kosuke Nakano | 2015-08-18 |
| 9105987 | Connection structure | Kosuke Nakano | 2015-08-11 |
| 9044816 | Solder paste, joining method using the same and joined structure | Kosuke Nakano | 2015-06-02 |
| 8975527 | Circuit board | — | 2015-03-10 |
| 8920580 | Solder paste and electronic device | Kosuke Nakano | 2014-12-30 |
| 8802998 | Ceramic multilayer substrate and method for producing the same | Yoshiko Okada, Osamu Chikagawa, Shodo Takei | 2014-08-12 |
| 8227536 | Lead-free solder paste and its use | Shizuharu Watanabe, Kosuke Nakano, Masafumi Seino, Ko Inaba | 2012-07-24 |
| 8222751 | Electroconductive bonding material and electronic apparatus | Akihiro Nomura, Kosuke Nakano | 2012-07-17 |
| 8105687 | Electroconductive bonding material and electronic apparatus | Akihiro Nomura, Kosuke Nakano | 2012-01-31 |
| 7777398 | Piezoelectric actuator | Shodo Takei, Shigeharu Kasai, Koichi Hayashi, Shizuharu Watanabe | 2010-08-17 |