Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522289 | Electronic component and electronic component series including the same | Shinichiro Kuroiwa, Kazuo Hattori, Isamu Fujimoto | 2019-12-31 |
| 10111325 | Elastic conductor | — | 2018-10-23 |
| 10090268 | Method of forming solder bump, and solder bump | Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima | 2018-10-02 |
| 8794499 | Method for manufacturing substrate | — | 2014-08-05 |
| 8570763 | Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate | — | 2013-10-29 |
| 8419884 | Method for manufacturing multilayer wiring substrate | — | 2013-04-16 |