Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090268 | Method of forming solder bump, and solder bump | Yasuyuki Sekimoto, Hidekiyo Takaoka, Minoru Ueshima, Tohru Kurushima | 2018-10-02 |
| 8069558 | Method for manufacturing substrate having built-in components | Katsuro Hirayama | 2011-12-06 |
| 7043951 | Wire rod-forming machine | Takashi Suzuki, Eiichi Kobayashi, Kazunori Sawayama | 2006-05-16 |
| 4871039 | Power steering system incorporating electric motor | Toshihiko Daido, Mitsugu Fujiwara | 1989-10-03 |