Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309932 | Electronic component module, sub-module, and method for manufacturing same | Tsuyoshi Takakura, Yoshihito Otsubo, Tadashi Nomura | 2025-05-20 |
| 10861683 | Vacuum device | Issei Yamamoto, Atsushi Shimizu, Yoichi Takagi, Toru Komatsu, Hideki Shinkai +1 more | 2020-12-08 |
| 10559535 | High-frequency module and manufacturing method therefor | Yoshihito Otsubo, Yoshihisa Masuda, Yuta MORIMOTO, Norio Sakai, Yoriyuki Matsumoto +1 more | 2020-02-11 |
| 10256195 | Module and method for manufacturing same | Issei Yamamoto, Atsushi Shimizu, Yoichi Takagi | 2019-04-09 |
| 9414513 | Electronic component module | Yoichi Takagi, Nobuaki Ogawa, Hidekiyo Takaoka, Kosuke Nakono, Akihiko Kamada +1 more | 2016-08-09 |
| 9276194 | Bonding method for bonding metal plate and piezoelectric body | Hiroki Kitayama, Kiyoshi Kurihara | 2016-03-01 |
| 9113571 | Electronic component module and method for manufacturing the same | Yoichi Takagi, Nobuaki Ogawa, Hidekiyo Takaoka, Kosuke Nakano | 2015-08-18 |
| 8726494 | Holding jig for electronic parts | Akio Katsube, Hidemasa Kawai | 2014-05-20 |
| 8492959 | Structure for bonding metal plate and piezoelectric body and bonding method | Hiroki Kitayama, Kiyoshi Kurihara | 2013-07-23 |
| 7928559 | Semiconductor device, electronic component module, and method for manufacturing semiconductor device | — | 2011-04-19 |
| 7624492 | Method for manufacturing electronic parts | Akio Katsube, Hidemasa Kawai | 2009-12-01 |