Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12304008 | Flux and method for producing assembly | Yasuhisa Sukawa, Hiroyuki Yamasaki, Haruya Sakuma | 2025-05-20 |
| 12194573 | Solder paste | Hiroyoshi Kawasaki, Yuji Kawamata | 2025-01-14 |
| 11833620 | Flux and solder paste | Yutaka Hashimoto, Kazuyori Takagi, Tomoko NAGAI, Nanako Miyagi, Kazuya Kitazawa +6 more | 2023-12-05 |
| 11826860 | Flux and solder paste | Hiroyoshi Kawasaki, Kazuhiro Minegishi, Yuji Kawamata | 2023-11-28 |
| 11819955 | Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device | Hiroyoshi Kawasaki, Yuji Kawamata | 2023-11-21 |
| 11813686 | Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate | Hiroyoshi Kawasaki, Yuji Kawamata | 2023-11-14 |
| 11772208 | Resin composition and soldering flux | Hiroyoshi Kawasaki, Hiroyuki Yamasaki | 2023-10-03 |
| 11590614 | Flux and solder paste | Ayaka SHIRAKAWA, Hiroshi Sugii, Atsumi Takahashi, Daisuke Maruko, Hiroyoshi Kawasaki | 2023-02-28 |
| 11583959 | Solder alloy, solder power, and solder joint | Hiroyoshi Kawasaki, Osamu Munekata | 2023-02-21 |
| 11571770 | Solder alloy, solder paste, solder ball, solder preform, and solder joint | Hiroyoshi Kawasaki, Yuji Kawamata | 2023-02-07 |
| 11377715 | Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit | Hiroyoshi Kawasaki, Yuji Kawamata | 2022-07-05 |
| 11376694 | Flux and solder paste | Tomohisa Kawanago, Miyuki Hiraoka, Takahiro Nishizaki, Hiroyoshi Kawasaki | 2022-07-05 |
| 11203087 | Flux and solder paste | Hiroyoshi Kawasaki, Tomohisa Kawanago | 2021-12-21 |
| 11130202 | Flux, and solder paste | Hiroyoshi Kawasaki, Yoshinori Takagi | 2021-09-28 |
| 10987764 | Flux and solder paste | Hiroyoshi Kawasaki, Ko Inaba, Hiroaki Kawamata, Kazuhiro Minegishi | 2021-04-27 |
| 10843298 | Flux and solder paste | Hiroyoshi Kawasaki, Takahiro Nishizaki, Tomohisa Kawanago | 2020-11-24 |
| 10780530 | Solder ball, solder joint, and joining method | Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Kaichi Tsuruta | 2020-09-22 |