Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712760 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Kaichi Tsuruta | 2023-08-01 |
| 11583959 | Solder alloy, solder power, and solder joint | Hiroyoshi Kawasaki, Masato Shiratori | 2023-02-21 |
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma +4 more | 2022-05-31 |
| 10780531 | Solder ball, solder joint, and joining method | Hiroyoshi Kawasaki, Yuri Nakamura, Kaichi Tsuruta | 2020-09-22 |
| 8216395 | Lead-free solder alloy | Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima | 2012-07-10 |
| 7682468 | Lead-free solder alloy | Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima | 2010-03-23 |
| 7628308 | Method of replenishing an oxidation suppressing element in a solder bath | Masayuki Ojima, Haruo Suzuki, Hirofumi Nogami, Norihisa Eguchi, Minoru Ueshima | 2009-12-08 |
| 7338567 | Lead-free solder alloy | Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima | 2008-03-04 |
| 7029542 | Lead-free solder alloy | Masazumi Amagai, Masako Watanabe, Kensho Murata, Yoshitaka Toyoda, Minoru Ueshima +2 more | 2006-04-18 |
| 6554180 | Lead-free solder paste | Rikiya Katoh, Yoshitaka Toyoda | 2003-04-29 |
| 6050480 | Solder paste for chip components | Toshihiko Taguchi, Rikiya Katoh, Yoshitaka Toyoda | 2000-04-18 |