Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6554180 | Lead-free solder paste | Osamu Munekata, Yoshitaka Toyoda | 2003-04-29 |
| 6503338 | Lead-free solder alloys | Toshihiko Taguchi, Yoshitaka Toyoda | 2003-01-07 |
| 6220501 | Method of joining metallic members, and joined metallic members | Masahiro Tadauchi, Izuru Komatsu, Kouichi Teshima, Jun Sugimoto, Takayuki Suzuki +1 more | 2001-04-24 |
| 6050480 | Solder paste for chip components | Toshihiko Taguchi, Osamu Munekata, Yoshitaka Toyoda | 2000-04-18 |