Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712760 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Osamu Munekata | 2023-08-01 |
| 10780530 | Solder ball, solder joint, and joining method | Hiroki Oshima, Takeo Saitoh, Takahiro Nishizaki, Tomohisa Kawanago, Masato Shiratori | 2020-09-22 |
| 10780531 | Solder ball, solder joint, and joining method | Hiroyoshi Kawasaki, Yuri Nakamura, Osamu Munekata | 2020-09-22 |
| 10722965 | Solder ball supplying method, solder ball supplying device, and solder bump forming method | Takeo Saito, Manabu Muraoka, Hiroki Oshima | 2020-07-28 |
| 10675719 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Takashi Hagiwara +3 more | 2020-06-09 |
| 10391589 | Flux applying device | Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Takashi Hagiwara +3 more | 2019-08-27 |
| 10265808 | Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder | Motohiro Onitsuka, Yoko Kurasawa, Toshihisa Kugi, Hiroshi Kawanago | 2019-04-23 |
| 10137538 | Liquid coating device | Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Takashi Hagiwara +3 more | 2018-11-27 |
| 10121606 | Method of manufacturing an electrode for an energy storage device | Katsuji Nakamura, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori | 2018-11-06 |
| 10111342 | Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet | Takeo Saitoh, Manabu Muraoka, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara | 2018-10-23 |
| 10081852 | Solder preform and a process for its manufacture | Naohiko Hirano, Akira Tanahashi, Yoshitsugu Sakamoto, Takashi Ishii, Satoshi Soga | 2018-09-25 |
| 9821397 | Solder precoating method and workpiece for electronic equipment | Takeo Kuramoto | 2017-11-21 |
| 9368249 | Method of manufacturing an electrode for an energy storage device | Katsuji Nakamura, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori | 2016-06-14 |
| 8961709 | Solder paste | Kunihito Takaura, Hiroshi Kawanakago, Hiroshi Takahashi | 2015-02-24 |
| 8701973 | Solder bump formation on a circuit board using a transfer sheet | Takeo Kuramoto, Takeo Saitou | 2014-04-22 |
| 7800230 | Solder preform and electronic component | Naohiko Hirano, Yoshitsugu Sakamoto, Tomomi Okumura, Minoru Ueshima, Takashi Ishii | 2010-09-21 |
| 7793820 | Solder preform and a process for its manufacture | Naohiko Hirano, Akira Tanahashi, Yoshitsugu Sakamoto, Takashi Ishii, Satoshi Soga | 2010-09-14 |
| 7112888 | Solder ball assembly for bump formation and method for its manufacture | Takeo Kuramoto | 2006-09-26 |
| 6919634 | Solder ball assembly, a method for its manufacture, and a method of forming solder bumps | Takeo Kuramoto | 2005-07-19 |
| 5377425 | Vacuum drying apparatus | Osamu Kawakami | 1995-01-03 |