Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10081852 | Solder preform and a process for its manufacture | Naohiko Hirano, Yoshitsugu Sakamoto, Kaichi Tsuruta, Takashi Ishii, Satoshi Soga | 2018-09-25 |
| 7793820 | Solder preform and a process for its manufacture | Naohiko Hirano, Yoshitsugu Sakamoto, Kaichi Tsuruta, Takashi Ishii, Satoshi Soga | 2010-09-14 |
| 7601625 | Method for manufacturing semiconductor device having solder layer | Chikage Noritake, Yoshitsugu Sakamoto, Hideki Okada, Tomomasa Yoshida | 2009-10-13 |
| 7579212 | Semiconductor device having tin-based solder layer and method for manufacturing the same | Kimiharu Kayukawa, Chikage Noritake, Shoji Miura | 2009-08-25 |
| 7361996 | Semiconductor device having tin-based solder layer and method for manufacturing the same | Kimiharu Kayukawa, Chikage Noritake, Shoji Miura | 2008-04-22 |
| 6488781 | Soldering paste, soldering method, and surface-mounted type electronic device | Norihisa Imaizumi, Seiji Shibata, Eiichi Sudo | 2002-12-03 |
| 6142363 | Soldering method using soldering flux and soldering paste | Norihisa Imaizumi, Yuzi Otani, Takashi Nagasaka | 2000-11-07 |
| 5919317 | Soldering flux, soldering paste and soldering method using the same | Norihisa Imaizumi, Yuzi Otani, Takashi Nagasaka | 1999-07-06 |