Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7746207 | Coil device | Mitsuhiro Yamashita, Hideki Miura, Yasuhiro Matsukawa, Kazuo Sato, Akira Sato +3 more | 2010-06-29 |
| D605662 | Coil unit | Hideki Miura | 2009-12-08 |
| 7551053 | Coil device | Mitsuhiro Yamashita, Hideki Miura, Yasuhiro Matsukawa, Kazuo Sato, Akira Sato +3 more | 2009-06-23 |
| 6940387 | Coil-embedded dust core and method for manufacturing the same | Kazuhiko Shibata, Junetsu Tamura, Yasuhiko Kitajima, Hideharu Moro, Tsutomu Chou +1 more | 2005-09-06 |
| 6888259 | Potted hybrid integrated circuit | Takeshi Ishikawa | 2005-05-03 |
| 6791445 | Coil-embedded dust core and method for manufacturing the same | Kazuhiko Shibata, Junetsu Tamura, Yasuhiko Kitajima, Hideharu Moro, Tsutomu Chou +1 more | 2004-09-14 |
| 6731001 | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same | Kan Kinouchi, Mitsuhiro Saitou, Yuji Ootani, Hiroyuki Yamakawa, Koji Takeuchi +3 more | 2004-05-04 |
| 6645606 | Electrical device having metal pad bonded with metal wiring and manufacturing method thereof | Tetsuo Nakano, Yukihiro Maeda, Yasutomi Asai | 2003-11-11 |
| 6601752 | Electronic part mounting method | Yukihiro Maeda, Yuji Ootani, Tetsuo Nakano | 2003-08-05 |
| 6458670 | Method of manufacturing a circuit substrate | — | 2002-10-01 |
| 6376906 | Mounting structure of semiconductor element | Yasutomi Asai, Shinji Ota | 2002-04-23 |
| 6326239 | Mounting structure of electronic parts and mounting method of electronic parts | Yasutomi Asai, Hirokazu Imai, Yuji Ootani | 2001-12-04 |
| 6217990 | Multilayer circuit board having no local warp on mounting surface thereof | Yasutomi Asai, Shinji Ota, Takashi Yamazaki, Shinya Terao, Syoichi Nakagawa | 2001-04-17 |
| 6201286 | Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same | — | 2001-03-13 |
| 6174462 | Conductive paste composition including conductive metallic powder | Kengo Oka, Yuji Ootani, Kazumasa Naito, Masayuki Miyairi | 2001-01-16 |
| 6142363 | Soldering method using soldering flux and soldering paste | Akira Tanahashi, Norihisa Imaizumi, Yuzi Otani | 2000-11-07 |
| 6079610 | Wire bonding method | Yukihiro Maeda, Toshio Suzuki | 2000-06-27 |
| 6048424 | Method for manufacturing ceramic laminated substrate | Yasutomi Asai, Kenichi Gohara, Takashi Yamasaki, Yoshiaki Shimojo | 2000-04-11 |
| 6020048 | Thick film circuit board and method of forming wire bonding electrode thereon | Kengo Oka | 2000-02-01 |
| 5919317 | Soldering flux, soldering paste and soldering method using the same | Akira Tanahashi, Norihisa Imaizumi, Yuzi Otani | 1999-07-06 |
| 5897724 | Method of producing a hybrid integrated circuit | — | 1999-04-27 |
| 5754093 | Thick-film printed substrate including an electrically connecting member and method for fabricating the same | Shinji Ota | 1998-05-19 |
| 5731067 | Multi-layered substrate | Yasutomi Asai | 1998-03-24 |
| 5729893 | Process for producing a multilayer ceramic circuit substrate | Nozomi Tanifuji, Akihiko Naito, Koji Sawada, Tohru Nomura, Yoshiyuki Miyase | 1998-03-24 |
| 5657203 | Electronic device having a plurality of circuit boards arranged therein | Yasunobu Hirao, Hidekazu Katsuyama, Makoto Koyama, Yuji Motoyama, Mamoru Urushizaki +1 more | 1997-08-12 |