Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328655 | Drive device and display apparatus | Takaaki Sugiyama, Ken Kikuchi, Atsushi Yasuda, Hiroshi Tobita | 2022-05-10 |
| 9566005 | Measuring apparatus, measuring method, and parameter setting method | Yoichi Toriumi, Hideo Kawabe, Kenichi Kabasawa, Tatsuya Suzuki, Masatoshi Ueno | 2017-02-14 |
| 9402559 | Input device and calibration method | Yoichi Toriumi, Hideo Kawabe, Kenichi Kabasawa, Tatsuya Suzuki, Masatoshi Ueno | 2016-08-02 |
| 8651699 | Flexible substrate, mounting method of flexible substrate, and lighting system | Hideo Kawabe, Yoichi Toriumi, Kenichi Kabasawa, Tatsuya Suzuki, Masatoshi Ueno | 2014-02-18 |
| 8605284 | Measurement device and measurement method | Yoichi Toriumi, Hideo Kawabe, Kenichi Kabasawa, Tatsuya Suzuki, Masatoshi Ueno | 2013-12-10 |
| 7807073 | Conductor composition, a mounting substrate and a mounting structure utilizing the composition | Masashi Totokawa, Yuji Ootani, Akira Shintai | 2010-10-05 |
| 7357883 | Conductive adhesive, method of producing the same, and bonding method | Yasunori Ninomiya, Masashi Totokawa, Yukinori Migitaka | 2008-04-15 |
| 7340908 | Refrigerant cycle device for vehicle | Hiroshi Oshitani, Katsuya Kusano, Hirotsugu Takeuchi, Mika Saito | 2008-03-11 |
| 7276185 | Conductor composition, a mounting substrate and a mounting structure utilizing the composition | Masashi Totokawa, Yuji Ootani, Akira Shintai | 2007-10-02 |
| 6731001 | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same | Kan Kinouchi, Mitsuhiro Saitou, Takashi Nagasaka, Yuji Ootani, Hiroyuki Yamakawa +3 more | 2004-05-04 |
| 6326239 | Mounting structure of electronic parts and mounting method of electronic parts | Yasutomi Asai, Yuji Ootani, Takashi Nagasaka | 2001-12-04 |
| 6239694 | Warning device for filter-changing time | Yuji Honda, Hitoshi Ninomiya | 2001-05-29 |