Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8179688 | Semiconductor device | Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Sadahiro Akama, Koji Numazaki +1 more | 2012-05-15 |
| 7843700 | Semiconductor device | Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Sadahiro Akama, Koji Numazaki +1 more | 2010-11-30 |
| 6731001 | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same | Mitsuhiro Saitou, Takashi Nagasaka, Yuji Ootani, Hiroyuki Yamakawa, Koji Takeuchi +3 more | 2004-05-04 |
| 6434006 | Semiconductor device having heat radiating member | Akihiro Fukatsu, Mitsuhiro Saito, Yoshiharu Harada | 2002-08-13 |
| 6172424 | Resin sealing type semiconductor device | Yukihiro Kato, Hiroshi Nomura, Michitake Kuroda | 2001-01-09 |