Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002841 | Semiconductor device | Shotaro Miyawaki, Naohiko Hirano, Akiyoshi Asai | 2018-06-19 |
| 9087924 | Semiconductor device with resin mold | Tetsuto Yamagishi, Tohru Nomura, Norihisa Imaizumi | 2015-07-21 |
| 8749055 | Semiconductor device with resin mold | Tetsuto Yamagishi, Tohru Nomura, Norihisa Imaizumi | 2014-06-10 |
| 8446003 | Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate | Atsushi Komura, Yasuhiro Kitamura, Nozomu Akagi | 2013-05-21 |
| 8309434 | Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon | Hiroshi Ishino | 2012-11-13 |
| 8207607 | Semiconductor device with resin mold | Tetsuto Yamagishi, Tohru Nomura, Norihisa Imaizumi | 2012-06-26 |
| 6645606 | Electrical device having metal pad bonded with metal wiring and manufacturing method thereof | Tetsuo Nakano, Yukihiro Maeda, Takashi Nagasaka | 2003-11-11 |
| 6376906 | Mounting structure of semiconductor element | Shinji Ota, Takashi Nagasaka | 2002-04-23 |
| 6326239 | Mounting structure of electronic parts and mounting method of electronic parts | Hirokazu Imai, Yuji Ootani, Takashi Nagasaka | 2001-12-04 |
| 6217990 | Multilayer circuit board having no local warp on mounting surface thereof | Takashi Nagasaka, Shinji Ota, Takashi Yamazaki, Shinya Terao, Syoichi Nakagawa | 2001-04-17 |
| 6048424 | Method for manufacturing ceramic laminated substrate | Takashi Nagasaka, Kenichi Gohara, Takashi Yamasaki, Yoshiaki Shimojo | 2000-04-11 |
| 5731067 | Multi-layered substrate | Takashi Nagasaka | 1998-03-24 |