Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11365154 | Silicon nitride-based sintered body and cutting insert | Hiroko Nakayama | 2022-06-21 |
| 11173555 | Surface-coated cutting tool | Shota NOZAKI, Fumihiro Kikkawa | 2021-11-16 |
| 10058925 | Sialon sintered body and cutting insert | Ryoji Toyoda, Fumihiro Kikkawa | 2018-08-28 |
| 9739927 | Light source device and display apparatus | Yoshitake Ishimoto | 2017-08-22 |
| 9196288 | Process and apparatus for producing optical recording medium | Shigeyuki Furomoto, Masafumi Aga, Toshifumi Kawano, Hideharu Takeshima, Yukari Kiritou +2 more | 2015-11-24 |
| 8446003 | Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate | Yasuhiro Kitamura, Nozomu Akagi, Yasutomi Asai | 2013-05-21 |
| 8007561 | Cermet insert and cutting tool | Tomoaki Shindo, Hiroaki Takashima, Toshiyuki Taniuchi, Masafumi Fukumura, Kei Takahashi | 2011-08-30 |
| 7901967 | Dicing method for semiconductor substrate | Muneo Tamura, Kazuhiko Sugiura, Hirotsugu Funato, Yumi Maruyama, Tetsuo Fujii +1 more | 2011-03-08 |
| 7838331 | Method for dicing semiconductor substrate | Tetsuo Fujii, Muneo Tamura, Makoto Asai | 2010-11-23 |
| 7762747 | Cermet insert and cutting tool | Toshiyuki Taniuchi, Masafumi Fukumura, Kei Takahashi, Tomoaki Shindo, Hiroaki Takashima | 2010-07-27 |
| 7642653 | Semiconductor device, wiring of semiconductor device, and method of forming wiring | Takeshi Kuzuhara, Mitsutaka Katada, Takayoshi Naruse | 2010-01-05 |
| 6885466 | Method for measuring thickness of oxide film | Hisato Kato, Hiroshi Otsuki | 2005-04-26 |
| 6348735 | Electrode for semiconductor device and method for manufacturing same | Tooru Yamaoka, Takeshi Yamauchi, Yoshihiko Isobe, Hiroyuki Yamane | 2002-02-19 |
| 6268298 | Method of manufacturing semiconductor device | Takeshi Kuzuhara, Noriyuki Iwamori, Manabu Koike, Jiro Sakata, Hirofumi Funahashi +2 more | 2001-07-31 |
| 6066891 | Electrode for semiconductor device including an alloy wiring layer for reducing defects in an aluminum layer and method for manufacturing the same | Tooru Yamaoka, Takeshi Yamauchi, Yoshihiko Isobe, Hiroyuki Yamane | 2000-05-23 |
| 5522966 | Dry etching process for semiconductor | Yoshikazu Sakano, Kenji Kondo, Keiichi Kon, Tetsuhiko Sanbei, Shoji Miura | 1996-06-04 |
| 5480832 | Method for fabrication of semiconductor device | Shoji Miura, Takayuki Sugisaka, Toshio Sakakibara | 1996-01-02 |
| 5423941 | Dry etching process for semiconductor | Yoshikazu Sakano, Kenji Kondo, Keiichi Kon, Tetsuhiko Sanbei, Shoji Miura | 1995-06-13 |
| 5018001 | Aluminum line with crystal grains | Kenji Kondo, Kazuo Akamatsu, Takeshi Yamauchi, Tooru Yamaoka | 1991-05-21 |