Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400923 | Semiconductor package, electronic device, and method for manufacturing semiconductor package | Akihiro Yamaguchi, Ryuma KAMIKOMAKI, Kouji Kondoh, Hirotaka MIYANO, Tomohiro Yokochi +1 more | 2025-08-26 |
| 12071227 | Multicopter | Hiroshi Ito | 2024-08-27 |
| 11824475 | Motor control device | Kenji Matsuda, Tatsuya Kakehi | 2023-11-21 |
| 11368057 | Motor having stator including respective laminations having protrusions of caulking dowel portions to secure said laminations | Tsuyoshi Nakagawa | 2022-06-21 |
| 11177714 | Motor | Tsuyoshi Nakagawa | 2021-11-16 |
| 9941182 | Electronic device and method for manufacturing same | Yuuki Sanada, Masayuki Takenaka, Shinya Uchibori, Kengo Oka, Tasuke Fukuda +1 more | 2018-04-10 |
| 9686854 | Electronic device | Yuuki Sanada, Shinya Uchibori, Masaji Imada, Toshihiro Nakamura, Eiji YABUTA +1 more | 2017-06-20 |
| 9473007 | Oscillating rotary swing actuator with rotary solenoid and projecting fixed yoke | Takeshi Kirihara, Takaya Kato, Osamu Sekiguchi, Shoji Oiwa | 2016-10-18 |
| 9087924 | Semiconductor device with resin mold | Tetsuto Yamagishi, Tohru Nomura, Yasutomi Asai | 2015-07-21 |
| D714737 | Rotary solenoid | Takeshi Kirihara, Osamu Sekiguchi, Takaya Kato, Shoji Oiwa | 2014-10-07 |
| 8749055 | Semiconductor device with resin mold | Tetsuto Yamagishi, Tohru Nomura, Yasutomi Asai | 2014-06-10 |
| 8207607 | Semiconductor device with resin mold | Tetsuto Yamagishi, Tohru Nomura, Yasutomi Asai | 2012-06-26 |
| 8179688 | Semiconductor device | Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Kan Kinouchi, Sadahiro Akama +1 more | 2012-05-15 |
| 7843700 | Semiconductor device | Yutaka Fukuda, Mitsuhiro Saitou, Toshihiro Nagaya, Kan Kinouchi, Sadahiro Akama +1 more | 2010-11-30 |
| 7612434 | Electronic device having wiring substrate and lead frame | Yuuki Sanada, Takeshi Ishikawa | 2009-11-03 |
| 7304370 | Electronic device having wiring substrate and lead frame | Yuuki Sanada, Takeshi Ishikawa | 2007-12-04 |
| 6488781 | Soldering paste, soldering method, and surface-mounted type electronic device | Akira Tanahashi, Seiji Shibata, Eiichi Sudo | 2002-12-03 |
| 6142363 | Soldering method using soldering flux and soldering paste | Akira Tanahashi, Yuzi Otani, Takashi Nagasaka | 2000-11-07 |
| 5919317 | Soldering flux, soldering paste and soldering method using the same | Akira Tanahashi, Yuzi Otani, Takashi Nagasaka | 1999-07-06 |