Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710709 | Terminal member made of plurality of metal layers between two heat sinks | Ryoichi KAIZU, Takumi Nomura, Yuki INABA, Yoshitsugu Sakamoto | 2023-07-25 |
| 10109557 | Electronic device having sealed heat-generation element | Toshihiro Nagaya, Masayuki Takenaka, Shinji Hiramitsu | 2018-10-23 |
| 9832872 | Method for manufacturing electronic device, and electronic device | Masayuki Takenaka, Toshihiro Nagaya, Shinji Hiramitsu | 2017-11-28 |
| 9601442 | Half-mold type mold package | Kengo Oka | 2017-03-21 |
| 9087924 | Semiconductor device with resin mold | Tohru Nomura, Norihisa Imaizumi, Yasutomi Asai | 2015-07-21 |
| 8749055 | Semiconductor device with resin mold | Tohru Nomura, Norihisa Imaizumi, Yasutomi Asai | 2014-06-10 |
| 8207607 | Semiconductor device with resin mold | Tohru Nomura, Norihisa Imaizumi, Yasutomi Asai | 2012-06-26 |