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Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns |
Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera +4 more |
2008-05-27 |
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Printed circuit board having colored outer layer |
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2008-01-29 |
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Method for manufacturing printed wiring board |
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2007-03-13 |
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Method for manufacturing printed wiring board with embedded electric device |
Koji Kondo, Toshihiro Miyake, Satoshi Takeuchi |
2007-01-23 |
| 7061599 |
Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates |
Yoshitaro Yazaki, Hiroshi Nagasaka |
2006-06-13 |
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Manufacturing method of rigid-flexible printed circuit board and structure thereof |
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2006-05-02 |
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Method of manufacturing a printed wiring board |
Yoshitaro Yazaki, Yoshihiko Shiraishi, Koji Kondo, Toshikazu Harada |
2005-12-06 |
| 6966482 |
Connecting structure of printed circuit boards |
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2005-11-22 |
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Manufacturing method of multilayer substrate |
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2005-02-15 |
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Printed wiring board and method for manufacturing printed wiring board |
Yoshitarou Yazaki, Koji Kondo, Toshikazu Harada, Yoshihiko Shiraishi |
2004-03-30 |
| 6680441 |
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
Koji Kondo, Toshihiro Miyake, Satoshi Takeuchi |
2004-01-20 |
| 6667443 |
Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya +2 more |
2003-12-23 |
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Printed wiring board and method of manufacturing a printed wiring board |
Yoshitaro Yazaki, Yoshihiko Shiraishi, Koji Kondo, Toshikazu Harada |
2003-11-04 |
| 6527162 |
Connecting method and connecting structure of printed circuit boards |
Makoto Totani, Toshihiro Miyake, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi +1 more |
2003-03-04 |
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Method for interconnecting printed circuit boards and interconnection structure |
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