Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605357 | Bonding method and bonding structure of thermoplastic resin material | Toshihiro Miyake, Katsuaki Kojima | 2003-08-12 |
| 6449836 | Method for interconnecting printed circuit boards and interconnection structure | Toshihiro Miyake, Katsuaki Kojima, Makoto Totani, Yoshitaro Yazaki, Takehito Teramae +3 more | 2002-09-17 |