Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784375 | Interconnection structure for interconnecting printed circuit boards | Toshihiro Miyake, Makoto Totani, Yoshitaro Yazaki | 2004-08-31 |
| 6605357 | Bonding method and bonding structure of thermoplastic resin material | Toshihiro Miyake, Hiroyasu Iwama | 2003-08-12 |
| 6449836 | Method for interconnecting printed circuit boards and interconnection structure | Toshihiro Miyake, Hiroyasu Iwama, Makoto Totani, Yoshitaro Yazaki, Takehito Teramae +3 more | 2002-09-17 |
| 5965211 | Electroless copper plating solution and process for formation of copper film | Koji Kondo, Seiji Amakusa, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa +1 more | 1999-10-12 |
| 5039338 | Electroless copper plating solution and process for formation of copper film | Koji Kondo, Seiji Amakusa, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa +1 more | 1991-08-13 |