Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5965211 | Electroless copper plating solution and process for formation of copper film | Koji Kondo, Seiji Amakusa, Katuhiko Murakawa, Katsuaki Kojima, Junji Ishikawa +1 more | 1999-10-12 |
| 5450870 | Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof | Makoto Suga, Masashi Niwa, Fumio Kojima, Koji Kondo | 1995-09-19 |
| 5248853 | Semiconductor element-mounting printed board | Junji Ishikawa, Kaoru Nomoto | 1993-09-28 |
| 5039338 | Electroless copper plating solution and process for formation of copper film | Koji Kondo, Seiji Amakusa, Katuhiko Murakawa, Katsuaki Kojima, Junji Ishikawa +1 more | 1991-08-13 |
| 4956014 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Futoshi Ishikawa, Junji Ishikawa | 1990-09-11 |
| 4935267 | Process for electrolessly plating copper and plating solution therefor | Koji Kondo, Katuhiko Murakawa, Junji Ishikawa, Kaoru Nomoto, Futoshi Ishikawa | 1990-06-19 |
| 4814009 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Futoshi Ishikawa, Junji Ishikawa | 1989-03-21 |
| 4790876 | Chemical copper-blating bath | Koji Kondo, Katuhiko Murakawa, Junji Ishikawa, Kaoru Nomoto, Futoshi Ishikawa | 1988-12-13 |
| 4239716 | Gypsum moldings as building materials and methods manufacturing the said gypsum moldings | Yasuo Yamada, Hideki Jinno | 1980-12-16 |