KN

Kaoru Nomoto

NC Nippondenso Co.: 6 patents #366 of 3,479Top 15%
DE Denso: 3 patents #3,857 of 11,792Top 35%
MP Mitsubishi Plastics: 2 patents #39 of 168Top 25%
KC Kuraray Co.: 1 patents #981 of 1,827Top 55%
Overall (All Time): #525,191 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6499217 Method of manufacturing three-dimensional printed wiring board Shingetsu Yamada, Jun Takagi, Koichiro TANIGUCHI, Toshihiro Miyake, Kazuya Sanada +1 more 2002-12-31
6274821 Shock-resistive printed circuit board and electronic device including the same Masashi Echigo, Masayuki Aoyama, Tadao Suzuki 2001-08-14
6228467 Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate Kouichirou Taniguchi, Jun Takagi, Hideo Yamano, Shingetsu Yamada, Kouji Kondo 2001-05-08
5248853 Semiconductor element-mounting printed board Junji Ishikawa, Nobumasa Ishida 1993-09-28
4956014 Electroless copper plating solution Koji Kondo, Katuhiko Murakawa, Futoshi Ishikawa, Nobumasa Ishida, Junji Ishikawa 1990-09-11
4935267 Process for electrolessly plating copper and plating solution therefor Koji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Futoshi Ishikawa 1990-06-19
4834796 Electroless copper plating solution and process for electrolessly plating copper Koji Kondo, Katuhiko Murakawa, Futoshi Ishikawa, Nobumasa Isida, Junji Isikawa 1989-05-30
4814009 Electroless copper plating solution Koji Kondo, Katuhiko Murakawa, Futoshi Ishikawa, Nobumasa Ishida, Junji Ishikawa 1989-03-21
4790876 Chemical copper-blating bath Koji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Futoshi Ishikawa 1988-12-13
4656195 Ethylene oxide adducts, method of producing same and cosmetics and ointments containing same Yoshin Tamai, Fumito Yamamoto, Manzo Shiono, Koichi Kanehira, Hiroshi Ozasa 1987-04-07