Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6499217 | Method of manufacturing three-dimensional printed wiring board | Shingetsu Yamada, Jun Takagi, Koichiro TANIGUCHI, Toshihiro Miyake, Kazuya Sanada +1 more | 2002-12-31 |
| 6274821 | Shock-resistive printed circuit board and electronic device including the same | Masashi Echigo, Masayuki Aoyama, Tadao Suzuki | 2001-08-14 |
| 6228467 | Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate | Kouichirou Taniguchi, Jun Takagi, Hideo Yamano, Shingetsu Yamada, Kouji Kondo | 2001-05-08 |
| 5248853 | Semiconductor element-mounting printed board | Junji Ishikawa, Nobumasa Ishida | 1993-09-28 |
| 4956014 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Futoshi Ishikawa, Nobumasa Ishida, Junji Ishikawa | 1990-09-11 |
| 4935267 | Process for electrolessly plating copper and plating solution therefor | Koji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Futoshi Ishikawa | 1990-06-19 |
| 4834796 | Electroless copper plating solution and process for electrolessly plating copper | Koji Kondo, Katuhiko Murakawa, Futoshi Ishikawa, Nobumasa Isida, Junji Isikawa | 1989-05-30 |
| 4814009 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Futoshi Ishikawa, Nobumasa Ishida, Junji Ishikawa | 1989-03-21 |
| 4790876 | Chemical copper-blating bath | Koji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Futoshi Ishikawa | 1988-12-13 |
| 4656195 | Ethylene oxide adducts, method of producing same and cosmetics and ointments containing same | Yoshin Tamai, Fumito Yamamoto, Manzo Shiono, Koichi Kanehira, Hiroshi Ozasa | 1987-04-07 |