Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454054 | Lock device | — | 2022-09-27 |
| 8143529 | Laminated multi-layer circuit board | Toshikazu Harada | 2012-03-27 |
| 7733665 | Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same | Toshikazu Harada | 2010-06-08 |
| 6228467 | Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate | Kouichirou Taniguchi, Jun Takagi, Hideo Yamano, Shingetsu Yamada, Kaoru Nomoto | 2001-05-08 |