Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5965211 | Electroless copper plating solution and process for formation of copper film | Koji Kondo, Seiji Amakusa, Katuhiko Murakawa, Katsuaki Kojima, Nobumasa Ishida +1 more | 1999-10-12 |
| 5405656 | Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor | Koji Kondo, Masahiro Irie | 1995-04-11 |
| 5039338 | Electroless copper plating solution and process for formation of copper film | Koji Kondo, Seiji Amakusa, Katuhiko Murakawa, Katsuaki Kojima, Nobumasa Ishida +1 more | 1991-08-13 |
| 4956014 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Nobumasa Ishida, Junji Ishikawa | 1990-09-11 |
| 4935267 | Process for electrolessly plating copper and plating solution therefor | Koji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Kaoru Nomoto | 1990-06-19 |
| 4834796 | Electroless copper plating solution and process for electrolessly plating copper | Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Nobumasa Isida, Junji Isikawa | 1989-05-30 |
| 4814009 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Nobumasa Ishida, Junji Ishikawa | 1989-03-21 |
| 4790876 | Chemical copper-blating bath | Koji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Kaoru Nomoto | 1988-12-13 |