Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12041753 | Electronic device | — | 2024-07-16 |
| 11849566 | Joint structure, electronic device and method for manufacturing the joint structure | Tadatomo Suga, Eiji Higurashi | 2023-12-19 |
| 11538733 | Electronic device | — | 2022-12-27 |
| 9970121 | Composite material, method for forming the composite material, electrode plated with the composite material, and connection structure having the composite material | Kenji Ochi, Yasuo Ishihara | 2018-05-15 |
| 9743531 | Electronic apparatus and manufacturing method of electronic apparatus | — | 2017-08-22 |
| 9698506 | Electric connection structure | — | 2017-07-04 |
| 9305676 | Composite material, electric contact electrode, electric contact film, conductive filler, electric contact structure using composite material, and manufacturing method of composite material | — | 2016-04-05 |
| 9093780 | Press-fit pin, connection structure including the press-fit pin, and electronic device including the press-fit pin | — | 2015-07-28 |
| 8187038 | Card edge connector and method of manufacturing the same | Takashi Kamiya, Taku Iida, Yoshio Hironaka, Masashi Hori | 2012-05-29 |
| 7931502 | Card edge connector and method for assembling the same | Taku Iida, Takashi Kamiya, Yoshio Hironaka, Masashi Hori | 2011-04-26 |
| 7748988 | Card edge connector and method of manufacturing the same | Masashi Hori, Taku Iida, Yasushi Matsumura, Yoshio Hironaka, Takashi Kamiya +2 more | 2010-07-06 |
| 7628654 | Card edge connector and method of manufacturing the same | Masashi Hori, Taku Iida, Yasushi Matsumura, Yoshio Hironaka, Takashi Kamiya +2 more | 2009-12-08 |
| 7481353 | Metal bonding method | — | 2009-01-27 |
| 7433019 | Exposure apparatus and device manufacturing method | Tohru Kiuchi | 2008-10-07 |
| 7417195 | Circuit board and circuit board connection structure | Makoto Totani, Fumio Kojima | 2008-08-26 |
| 7286367 | Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board | Satoshi Takeuchi, Koji Kondo, Toshikazu Harada, Masayuki Aoyama, Yoshitaro Yazaki +6 more | 2007-10-23 |
| 7165321 | Method for manufacturing printed wiring board with embedded electric device | Koji Kondo, Tomohiro Yokochi, Satoshi Takeuchi | 2007-01-23 |
| 7080445 | Method for connecting printed circuit boards and connected printed circuit boards | Kazuyuki Deguchi, Yoshitaro Yazaki, Hiroaki Maeda, Mitsutoshi Miyazaki, Makoto Totani +2 more | 2006-07-25 |
| 6966482 | Connecting structure of printed circuit boards | Makoto Totani, Tomohiro Yokochi, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi +1 more | 2005-11-22 |
| 6784375 | Interconnection structure for interconnecting printed circuit boards | Katsuaki Kojima, Makoto Totani, Yoshitaro Yazaki | 2004-08-31 |
| 6769598 | Method of connecting circuit boards | Yoshitaro Yazaki | 2004-08-03 |
| 6719187 | Method of connecting circuit boards | Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki | 2004-04-13 |
| 6680441 | Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device | Koji Kondo, Tomohiro Yokochi, Satoshi Takeuchi | 2004-01-20 |
| 6657137 | Connection structure and connection method of for connecting two circuit boards | Kazuya Sanada | 2003-12-02 |
| 6605357 | Bonding method and bonding structure of thermoplastic resin material | Katsuaki Kojima, Hiroyasu Iwama | 2003-08-12 |