Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12409644 | Substrate bonding method and substrate bonding system | Akira Yamauchi | 2025-09-09 |
| 12388045 | Bonding system and bonding method | Akira Yamauchi | 2025-08-12 |
| 12351511 | Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate | Yoshiie Matsumoto | 2025-07-08 |
| 12275670 | Method for joining transparent substrates | Yoshiie Matsumoto | 2025-04-15 |
| 12261147 | Bonding system and bonding method | Akira Yamauchi | 2025-03-25 |
| 11849566 | Joint structure, electronic device and method for manufacturing the joint structure | Toshihiro Miyake, Eiji Higurashi | 2023-12-19 |
| 11837444 | Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device | Akira Yamauchi | 2023-12-05 |
| 10204785 | Substrate bonding apparatus and substrate bonding method | Akira Yamauchi | 2019-02-12 |
| 10166749 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto | 2019-01-01 |
| 10043975 | Thin substrate, method for manufacturing same, and method for transporting substrate | Yoshiie Matsumoto | 2018-08-07 |
| 9962908 | Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate | Yoshiie Matsumoto | 2018-05-08 |
| 9870922 | Substrate bonding apparatus and substrate bonding method | Akira Yamauchi | 2018-01-16 |
| 9601350 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto | 2017-03-21 |
| 9331305 | Electronic element sealing method and bonded substrate | Yoshiie Matsumoto | 2016-05-03 |
| 9142532 | Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer | Akira Yamauchi | 2015-09-22 |
| 8915418 | Electronic component bonding method | Toshiyuki Shiratori, Toru Kawasaki, Masataka Mizukoshi | 2014-12-23 |
| 8875977 | Element pressing apparatus and heating system using element pressing apparatus | Toshiyuki Shiratori, Toru Kawasaki, Masataka Mizukoshi | 2014-11-04 |
| 8651363 | Joining method and device produced by this method and joining unit | Masuaki Okada | 2014-02-18 |
| 8246926 | Fullerene hollow structure needle crystal and C60-C70 mixed fine wire, and method for preparation thereof | Kun'ichi Miyazawa, Masahisa Fujino, Masaru Tachibana, Ken Kobayashi | 2012-08-21 |
| 8091764 | Joining method and device produced by this method and joining unit | Masuaki Okada | 2012-01-10 |
| 7976814 | Fullerene derivative fine wire and its manufacturing method | Kun'ichi Miyazawa, Tadahiko Mashino | 2011-07-12 |
| 7784670 | Joining method and device produced by this method and joining unit | Masuaki Okada | 2010-08-31 |
| 7776735 | Semiconductor device and process for manufacturing the same | Toshihiro Itoh | 2010-08-17 |
| 7688088 | Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object | Shigekazu Komatsu, Toshihiro Itoh, Kenichi Kataoka | 2010-03-30 |
| 7686912 | Method for bonding substrates and method for irradiating particle beam to be utilized therefor | Taehyun Kim, Tomoyuki Abe | 2010-03-30 |