Issued Patents All Time
Showing 1–25 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12409644 | Substrate bonding method and substrate bonding system | Tadatomo Suga | 2025-09-09 |
| 12388045 | Bonding system and bonding method | Tadatomo Suga | 2025-08-12 |
| 12381526 | Amplifier circuit and sensor circuit | Hiroshi Yoshino | 2025-08-05 |
| 12341036 | Resin shaping device | — | 2025-06-24 |
| 12283370 | Facility presentation apparatus, facility presentation method and recording medium | Masahiro Hayashitani, Masahiro Kubo, Akihiko SHIBANO, Takayuki Banno, Junichi YAHARA +2 more | 2025-04-22 |
| 12267052 | Power amplifying device | — | 2025-04-01 |
| 12261070 | Component mounting system and component mounting method | — | 2025-03-25 |
| 12261147 | Bonding system and bonding method | Tadatomo Suga | 2025-03-25 |
| 12187010 | Glass structure, adhesive structure, and method for producing glass structure | Masayuki SASE | 2025-01-07 |
| 12094747 | Substrate bonding device | — | 2024-09-17 |
| 11837444 | Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device | Tadatomo Suga | 2023-12-05 |
| 11587804 | Component mounting system | — | 2023-02-21 |
| 11437958 | Power amplifying device and audio system | Hiroyuki Tsurumi | 2022-09-06 |
| 11171617 | Power amplifying device and audio equipment | Hiroyuki Tsurumi | 2021-11-09 |
| 10795559 | Data positioning method, data positioning apparatus, and computer program | — | 2020-10-06 |
| 10580752 | Method for bonding substrates together, and substrate bonding device | — | 2020-03-03 |
| 10581422 | PWM modulator | Toshikazu Fujii | 2020-03-03 |
| 10204785 | Substrate bonding apparatus and substrate bonding method | Tadatomo Suga | 2019-02-12 |
| 10166749 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Tadatomo Suga, Ryuichi Kondou, Yoshiie Matsumoto | 2019-01-01 |
| 9870922 | Substrate bonding apparatus and substrate bonding method | Tadatomo Suga | 2018-01-16 |
| 9692371 | Current feedback output circuit | Hiroyuki Tsurumi | 2017-06-27 |
| 9601350 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Tadatomo Suga, Ryuichi Kondou, Yoshiie Matsumoto | 2017-03-21 |
| 9384717 | Tone generation assigning apparatus and method | Masahiro Kakishita, Tomoko Okumura | 2016-07-05 |
| 9379082 | Pressure application apparatus and pressure application method | — | 2016-06-28 |
| 9243894 | Pressure application apparatus and pressure application method | — | 2016-01-26 |