Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217557 | Laminated inductor | Takayuki Arai, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake | 2019-02-26 |
| 10166749 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Tadatomo Suga, Akira Yamauchi, Yoshiie Matsumoto | 2019-01-01 |
| 10096418 | Laminated inductor | Takayuki Arai, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake | 2018-10-09 |
| 9892843 | Laminated inductor | Takayuki Arai, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake | 2018-02-13 |
| 9601350 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Tadatomo Suga, Akira Yamauchi, Yoshiie Matsumoto | 2017-03-21 |
| 8853544 | Method of transferring thin film components and circuit board having the same | Kenichi Ota | 2014-10-07 |
| 7847469 | Micro-cantilever | Kentaro Nakamura | 2010-12-07 |