TS

Tadatomo Suga

UN Unknown: 29 patents #103 of 83,584Top 1%
BC Bondtech Co.: 11 patents #2 of 5Top 40%
Sharp Kabushiki Kaisha: 9 patents #1,853 of 10,731Top 20%
KT Kabushiki Kaisha Toshiba: 8 patents #3,802 of 21,451Top 20%
Fujitsu Limited: 8 patents #3,989 of 24,456Top 20%
SO Sony: 8 patents #5,352 of 25,231Top 25%
Rohm Co.: 8 patents #378 of 2,292Top 20%
SC Sanyo Electric Co.: 7 patents #794 of 6,347Top 15%
NE Nec: 7 patents #2,006 of 14,502Top 15%
OC Oki Electric Industry Co.: 7 patents #247 of 2,807Top 9%
RT Renesas Technology: 6 patents #492 of 3,337Top 15%
TL Tokyo Electron Limited: 6 patents #1,241 of 5,567Top 25%
TS Tadatomo Suga: 6 patents #1 of 12Top 9%
Sumitomo Electric Industries: 5 patents #5,365 of 21,551Top 25%
LC Lan Technical Service Co.: 5 patents #2 of 4Top 50%
PA Panasonic: 3 patents #7,617 of 21,108Top 40%
Mitsubishi Electric: 3 patents #8,691 of 25,717Top 35%
HI Hitachi: 3 patents #10,712 of 28,497Top 40%
SC Senju Metal Industry Co.: 2 patents #126 of 349Top 40%
NS National Institute For Materials Science: 2 patents #189 of 901Top 25%
AC Ayumi Industry Co.: 2 patents #2 of 8Top 25%
TC Toray Engineering Co.: 1 patents #46 of 169Top 30%
TC Toyo Kohan Co.: 1 patents #160 of 295Top 55%
DE Denso: 1 patents #6,940 of 11,792Top 60%
SC Shinko-Seiki Co.: 1 patents #8 of 19Top 45%
SC Shinko Electric Industries Co.: 1 patents #437 of 723Top 65%
TC Taiyo Yuden Co.: 1 patents #643 of 959Top 70%
OC Oki Semiconductor Co.: 1 patents #202 of 526Top 40%
Overall (All Time): #69,257 of 4,157,543Top 2%
43
Patents All Time

Issued Patents All Time

Showing 26–43 of 43 patents

Patent #TitleCo-InventorsDate
7591293 Device for bonding a metal on a surface of a substrate Toshihiro Ito, Akira Yamauchi 2009-09-22
7550366 Method for bonding substrates and device for bonding substrates Mohammad Matiar Rahman Howlader, Tomoyuki Abe 2009-06-23
7319339 Inspection apparatus to break the oxide of an electrode by fritting phenomenon Shinji Iino, Kiyoshi Takekoshi, Toshihiro Itoh, Kenichi Kataoka 2008-01-15
7304489 Inspection method and inspection apparatus Shinji Iino, Kiyoshi Takekoshi, Toshihiro Itoh, Kenichi Kataoka 2007-12-04
7301243 High-reliable semiconductor device using hermetic sealing of electrodes Toshihiro Itoh 2007-11-27
7268430 Semiconductor device and process for manufacturing the same Toshihiro Itoh 2007-09-11
7262613 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object Shigekazu Komatsu, Toshihiro Itoh, Kenichi Kataoka 2007-08-28
7217631 Semiconductor device and method for fabricating the device 2007-05-15
7183190 Semiconductor device and fabrication method therefor Kinji Saijo, Shingji Ohsawa, Hiroaki Okamoto, Kazuo Yoshida 2007-02-27
7100279 Method of mounting an electronic part Toshihiro Itoh, Hideto Nakazawa, Masatoshi Akagawa 2006-09-05
7078811 Semiconductor device and method for fabricating the device 2006-07-18
7061259 Inspection method and inspection apparatus Shinji Iino, Kiyoshi Takekoshi, Toshihiro Itoh, Kenichi Kataoka 2006-06-13
6975489 Circuit structure and semiconductor integrated circuit Kanji Otsuka, Tamotsu Usami 2005-12-13
6935553 Reflow soldering method Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Johji Kagami, Rikiya Kato +1 more 2005-08-30
6887319 Residue-free solder paste Keisuke Saito, Rikiya Kato, Sakie Yamagata 2005-05-03
6777967 Inspection method and inspection apparatus Shinji Iino, Kiyoshi Takekoshi, Toshihiro Itoh, Kenichi Kataoka 2004-08-17
6472293 Method for manufacturing an interconnect structure for stacked semiconductor device 2002-10-29
6465892 Interconnect structure for stacked semiconductor device 2002-10-15