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USPTO Patent Rankings Data through Dec 31, 2025
TU

Tamotsu Usami — 24 Patents

UNUnknown: 39 patents #46 of 83,584Top 1%
Kabushiki Kaisha Toshiba: 17 patents #1,761 of 21,451Top 9%
Nec: 14 patents #846 of 14,502Top 6%
Sony: 14 patents #3,127 of 25,231Top 15%
Fujitsu Limited: 14 patents #2,150 of 24,456Top 9%
Sharp Kabushiki Kaisha: 14 patents #1,181 of 10,731Top 15%
Rohm Co.: 14 patents #195 of 2,292Top 9%
OCOki Electric Industry Co.: 14 patents #69 of 2,807Top 3%
SCSanyo Electric Co.: 14 patents #301 of 6,347Top 5%
Sumitomo Electric Industries: 11 patents #2,408 of 21,551Top 15%
Hitachi: 9 patents #4,654 of 28,497Top 20%
RTRenesas Technology: 8 patents #341 of 3,337Top 15%
Mitsubishi Electric: 8 patents #3,714 of 25,717Top 15%
Panasonic: 4 patents #6,210 of 21,108Top 30%
FIFujifilm Business Innovation: 3 patents #2,684 of 5,238Top 55%
Kyocera: 3 patents #999 of 3,732Top 30%
FLFujitsu Microelectronics Limited: 3 patents #51 of 624Top 9%
OCOki Semiconductor Co.: 2 patents #109 of 526Top 25%
MCM-Tec Co.: 1 patents #11 of 25Top 45%
RERenesas Electronics: 1 patents #2,739 of 4,529Top 65%
FUFujikura: 1 patents #788 of 1,407Top 60%
ICIbiden Co.: 1 patents #451 of 730Top 65%
Nagakute, JP: #27 of 320 inventorsTop 9%
Overall (All Time): #168,038 of 4,157,543Top 5%
24 Patents All Time
Tamotsu Usami has been granted 24 US patents while listed as an inventor at Unknown. The first was granted in 1985 and the most recent in September 2019. Tamotsu Usami ranks #168,038 of 4,157,543 US inventors in our database (top 4.0%). Patent records list Tamotsu Usami in Nagakute, JP.

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10424514 Method for manufacturing semiconductor substrate Mitsuharu Kato, Tadashi Shimada 2019-09-24
8217466 High-speed semiconductor device and method for manufacturing the same Kanji Otsuka, Fumio Mizuno, Munekazu Takano 2012-07-10
7872612 Antenna apparatus utilizing aperture of transmission line Kanji Otsuka, Yutaka Akiyama, Chihiro Ueda 2011-01-18 $844,000
7791852 Electrostatic discharge protection circuit and terminating resistor circuit Kanji Otsuka, Yutaka Akiyama, Tsuneo Ito, Yuko Tanba 2010-09-07 $64,000
7631422 Method of manufacturing wiring substrate having terminated buses Kanji Otsuka 2009-12-15
7446625 Narrow impedance conversion device Kanji Otsuka, Yutaka Akiyama 2008-11-04 $128,000
7446567 Signal transmission apparatus and interconnection structure Kanji Otsuka 2008-11-04
7295032 High-speed signal transmission system Kanji Otsuka, Tetsuya Higuchi, Eiichi Takahashi, Yuji Kasai, Masahiro Murakawa 2007-11-13
7280385 Semiconductor memory device Kanji Otsuka 2007-10-09
7190188 Signal transmission system, and signal transmission line Kanji Otsuka 2007-03-13
7173449 Signal transmission system Kanji Otsuka 2007-02-06
7116184 Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture Kanji Otsuka 2006-10-03
7113002 Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals Kanji Otsuka, Chihiro Ueda, Yutaka Akiyama, Osamu Koyasu 2006-09-26 $6,900,000
6975489 Circuit structure and semiconductor integrated circuit Kanji Otsuka, Tadatomo Suga 2005-12-13
6961229 Electronic circuit device Kanji Otsuka 2005-11-01
6914502 Wiring structure for transmission line having grooved conductors Kanji Otsuka 2005-07-05
6812742 Electronic device Kanji Otsuka 2004-11-02
6731153 Semiconductor integrated circuit having switching transistors and varactors Kanji Otsuka 2004-05-04 $298,000
6670830 Driver circuit, receiver circuit, and signal transmission bus system Kanji Otsuka 2003-12-30
6630629 Wiring substrate Kanji Otsuka 2003-10-07
6625005 Semiconductor circuit device having power and ground lines adapted for high-frequency operation Kanji Otsuka 2003-09-23
6476330 Wiring substrate and process for producing the same Kanji Otsuka 2002-11-05
6373275 Electronic device capable of greatly improving signal transmission speed in a bus wiring system Kanji Otsuka 2002-04-16
4527730 Wire bonding apparatus Yuji Shirai, Kanji Otsuka, Yasuyuki Yamasaki 1985-07-09 $30,000