| 10424514 |
Method for manufacturing semiconductor substrate |
Mitsuharu Kato, Tadashi Shimada |
2019-09-24 |
| 8217466 |
High-speed semiconductor device and method for manufacturing the same |
Kanji Otsuka, Fumio Mizuno, Munekazu Takano |
2012-07-10 |
| 7872612 |
Antenna apparatus utilizing aperture of transmission line |
Kanji Otsuka, Yutaka Akiyama, Chihiro Ueda |
2011-01-18 |
| 7791852 |
Electrostatic discharge protection circuit and terminating resistor circuit |
Kanji Otsuka, Yutaka Akiyama, Tsuneo Ito, Yuko Tanba |
2010-09-07 |
| 7631422 |
Method of manufacturing wiring substrate having terminated buses |
Kanji Otsuka |
2009-12-15 |
| 7446625 |
Narrow impedance conversion device |
Kanji Otsuka, Yutaka Akiyama |
2008-11-04 |
| 7446567 |
Signal transmission apparatus and interconnection structure |
Kanji Otsuka |
2008-11-04 |
| 7295032 |
High-speed signal transmission system |
Kanji Otsuka, Tetsuya Higuchi, Eiichi Takahashi, Yuji Kasai, Masahiro Murakawa |
2007-11-13 |
| 7280385 |
Semiconductor memory device |
Kanji Otsuka |
2007-10-09 |
| 7190188 |
Signal transmission system, and signal transmission line |
Kanji Otsuka |
2007-03-13 |
| 7173449 |
Signal transmission system |
Kanji Otsuka |
2007-02-06 |
| 7116184 |
Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture |
Kanji Otsuka |
2006-10-03 |
| 7113002 |
Transmission cable structure for GHz frequency band signals and connector used for transmission of GHz frequency band signals |
Kanji Otsuka, Chihiro Ueda, Yutaka Akiyama, Osamu Koyasu |
2006-09-26 |
| 6975489 |
Circuit structure and semiconductor integrated circuit |
Kanji Otsuka, Tadatomo Suga |
2005-12-13 |
| 6961229 |
Electronic circuit device |
Kanji Otsuka |
2005-11-01 |
| 6914502 |
Wiring structure for transmission line having grooved conductors |
Kanji Otsuka |
2005-07-05 |
| 6812742 |
Electronic device |
Kanji Otsuka |
2004-11-02 |
| 6731153 |
Semiconductor integrated circuit having switching transistors and varactors |
Kanji Otsuka |
2004-05-04 |
| 6670830 |
Driver circuit, receiver circuit, and signal transmission bus system |
Kanji Otsuka |
2003-12-30 |
| 6630629 |
Wiring substrate |
Kanji Otsuka |
2003-10-07 |
| 6625005 |
Semiconductor circuit device having power and ground lines adapted for high-frequency operation |
Kanji Otsuka |
2003-09-23 |
| 6476330 |
Wiring substrate and process for producing the same |
Kanji Otsuka |
2002-11-05 |
| 6373275 |
Electronic device capable of greatly improving signal transmission speed in a bus wiring system |
Kanji Otsuka |
2002-04-16 |
| 4527730 |
Wire bonding apparatus |
Yuji Shirai, Kanji Otsuka, Yasuyuki Yamasaki |
1985-07-09 |
