Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8388724 | Solder paste | Rikiya Kato | 2013-03-05 |
| 6935553 | Reflow soldering method | Tadatomo Suga, Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Johji Kagami +1 more | 2005-08-30 |
| 6887319 | Residue-free solder paste | Tadatomo Suga, Keisuke Saito, Rikiya Kato | 2005-05-03 |