Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8962470 | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus | Yoshikatsu Ishizuki, Kanae Nakagawa, Keishiro Okamoto, Kazuo Teshirogi, Taiji Sakai | 2015-02-24 |
| 8915418 | Electronic component bonding method | Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga | 2014-12-23 |
| 8875977 | Element pressing apparatus and heating system using element pressing apparatus | Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga | 2014-11-04 |
| 8735274 | Manufacture method for semiconductor device with bristled conductive nanotubes | Taisuke Iwai | 2014-05-27 |
| 8704106 | Ferroelectric component and manufacturing the same | Yoshikatsu Ishizuki | 2014-04-22 |
| 8479386 | Method for manufacturing interposer | Takeshi Shioga, Kazuaki Kurihara, Kanae Nakagawa, Taiji Sakai | 2013-07-09 |
| 8409931 | Method of manufacturing semiconductor device | Taiji Sakai, Nobuhiro Imaizumi | 2013-04-02 |
| 8293577 | Semiconductor package and method of manufacturing the same | Yuji Awano | 2012-10-23 |
| 8216934 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Takao Nishimura +2 more | 2012-07-10 |
| 8058110 | Plating method, semiconductor device fabrication method and circuit board fabrication method | Kanae Nakagawa, Takeshi Shioga, Kazuaki Kurihara, John David Baniecki | 2011-11-15 |
| 7935573 | Electronic device and method for fabricating the same | — | 2011-05-03 |
| 7927998 | Plating method, semiconductor device fabrication method and circuit board fabrication method | Kanae Nakagawa, Takeshi Shioga, Kazuaki Kurihara, John David Baniecki | 2011-04-19 |
| 7884459 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Takao Nishimura +2 more | 2011-02-08 |
| 7863524 | Interposer and method for manufacturing the same | Takeshi Shioga, Kazuaki Kurihara, Kanae Nakagawa, Taiji Sakai | 2011-01-04 |
| 7846852 | Method for manufacturing capacitor embedded in interposer | Takeshi Shioga, Kazuaki Kurihara | 2010-12-07 |
| 7830009 | Semiconductor package and method of manufacturing the same | Yuji Awano | 2010-11-09 |
| 7816180 | Method for processing a base that includes connecting a first base to a second base | Nobuhiro Imaizumi, Yoshikatsu Ishizuki | 2010-10-19 |
| 7811835 | Method for processing a base that includes connecting a first base to a second base with an insulating film | Nobuhiro Imaizumi, Yoshikatsu Ishizuki | 2010-10-12 |
| 7778009 | Thin-film capacitor and method of manufacturing the same | Takeshi Shioga, Masatoshi Ishii, Kazuaki Kurihara, Teru Nakanishi | 2010-08-17 |
| 7745924 | Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer | Takeshi Shioga, Kazuaki Kurihara | 2010-06-29 |
| 7704856 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Kanae Nakagawa, Kazuo Teshirogi | 2010-04-27 |
| 7670940 | Plating method, semiconductor device fabrication method and circuit board fabrication method | Kanae Nakagawa, Takeshi Shioga, Kazuaki Kurihara, John David Baniecki | 2010-03-02 |
| 7648907 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Kanae Nakagawa, Kazuo Teshirogi | 2010-01-19 |
| 7633148 | Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes | Yuji Awano, Taisuke Iwai, Tomoji Nakamura | 2009-12-15 |
| 7614142 | Method for fabricating an interposer | Takeshi Shioga, Yoshikatsu Ishizuki, Kanae Nakagawa, Taiji Sakai, John David Baniecki +1 more | 2009-11-10 |