Issued Patents All Time
Showing 1–25 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9268034 | Nuclear reactor fuel integrity monitor | Kenichiro Kino | 2016-02-23 |
| 9134433 | Nuclear reactor fuel integrity monitor | Kenichiro Kino | 2015-09-15 |
| 9076559 | Method of operating nuclear plant | Ryuji Umehara | 2015-07-07 |
| 9005082 | Control device and control method for vehicle | Koji Okamura, Masatomo Yoshihara, Fumikazu Satou | 2015-04-14 |
| 8841776 | Stacked semiconductor chips having double adhesive insulating layer interposed therebetween | Yoshiaki Narisawa | 2014-09-23 |
| 8810043 | Semiconductor device | Yoshikazu Kumagaya, Akira Takashima, Kouichi Nakamura, Kazuyuki Aiba | 2014-08-19 |
| 8748229 | Manufacturing method including deformation of supporting board to accommodate semiconductor device | Takayuki Norimatsu | 2014-06-10 |
| 8659168 | Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board | Yoshikazu Kumagaya | 2014-02-25 |
| 8404980 | Relay board and semiconductor device having the relay board | Kouichi Nakamura | 2013-03-26 |
| 8230590 | Method for mounting electronic components | Yoshiaki Narisawa | 2012-07-31 |
| 8216934 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi +2 more | 2012-07-10 |
| 8198728 | Semiconductor device and plural semiconductor elements with suppressed bending | — | 2012-06-12 |
| 8134240 | Semiconductor device and manufacturing method for the same | Yoshiaki Narisawa | 2012-03-13 |
| 8125789 | Wiring substrate and electronic device | — | 2012-02-28 |
| 8076769 | Semiconductor device and manufacturing method of semiconductor device | Yoshikazu Kumagaya | 2011-12-13 |
| 8076785 | Semiconductor device | Yoshikazu Kumagaya, Akira Takashima, Kouichi Nakamura, Kazuyuki Aiba | 2011-12-13 |
| 8048719 | Semiconductor device and manufacturing method thereof | Tetsuya Hiraoka | 2011-11-01 |
| 7973404 | Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device | Yoshiaki Narisawa, Yoshikazu Kumagaya | 2011-07-05 |
| 7906852 | Semiconductor device and manufacturing method of the same | Yoshiaki Narisawa | 2011-03-15 |
| 7884459 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi +2 more | 2011-02-08 |
| 7880276 | Wiring board and semiconductor device | Kazuyuki Aiba | 2011-02-01 |
| 7755203 | Circuit substrate and semiconductor device | Kazuyuki Aiba | 2010-07-13 |
| 7687319 | Semiconductor device and manufacturing method thereof | Kouichi Nakamura | 2010-03-30 |
| 7679188 | Semiconductor device having a bump formed over an electrode pad | — | 2010-03-16 |
| 7528460 | Semiconductor device sealed with electrical insulation sealing member | Tetsuya Hiraoka | 2009-05-05 |