Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922923 | Method of manufacturing wiring substrate and wiring substrate | — | 2018-03-20 |
| 8841776 | Stacked semiconductor chips having double adhesive insulating layer interposed therebetween | Takao Nishimura | 2014-09-23 |
| 8230590 | Method for mounting electronic components | Takao Nishimura | 2012-07-31 |
| 8134240 | Semiconductor device and manufacturing method for the same | Takao Nishimura | 2012-03-13 |
| 7973404 | Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device | Takao Nishimura, Yoshikazu Kumagaya | 2011-07-05 |
| 7906852 | Semiconductor device and manufacturing method of the same | Takao Nishimura | 2011-03-15 |