Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10236231 | Semiconductor device | Takeshi Miyakoshi, Sumikazu Hosoyamada, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more | 2019-03-19 |
| 10134710 | Semiconductor package | Takeshi Miyakoshi, Sumikazu Hosoyamada, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more | 2018-11-20 |
| 9635762 | Semiconductor package | Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Hiroshi Demachi, Takeshi Miyakoshi +8 more | 2017-04-25 |
| 9601450 | Semiconductor package | Takeshi Miyakoshi, Sumikazu Hosoyamada, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more | 2017-03-21 |
| 9368474 | Manufacturing method for semiconductor device | Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hirokazu Honda +8 more | 2016-06-14 |
| 9362200 | Heat sink in the aperture of substrate | Hirokazu Honda, Shinji Watanabe, Toshihiro Iwasaki, Kiminori Ishido, Koichiro Niwa +6 more | 2016-06-07 |
| 8810043 | Semiconductor device | Takao Nishimura, Akira Takashima, Kouichi Nakamura, Kazuyuki Aiba | 2014-08-19 |
| 8659168 | Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board | Takao Nishimura | 2014-02-25 |
| 8076769 | Semiconductor device and manufacturing method of semiconductor device | Takao Nishimura | 2011-12-13 |
| 8076785 | Semiconductor device | Takao Nishimura, Akira Takashima, Kouichi Nakamura, Kazuyuki Aiba | 2011-12-13 |
| 7973404 | Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device | Takao Nishimura, Yoshiaki Narisawa | 2011-07-05 |
| 6869819 | Recognition method of a mark provided on a semiconductor device | Mitsuhisa Watanabe, Akira Takashima | 2005-03-22 |
| 6457633 | Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls | Akira Takashima, Kazuya KAMIMURA | 2002-10-01 |
| 6291895 | Method of fabricating semiconductor having through hole | Fumihiko Taniguchi, Koji Honna | 2001-09-18 |
| 6281571 | Semiconductor device having an external connection electrode extending through a through hole formed in a substrate | Akira Takashima, Fumihiko Ando, Mitsuru Sato, Takashi Suzuki, Kazunari Kosakai | 2001-08-28 |
| 5953592 | Method of fabricating semiconductor having through hole | Fumihiko Taniguchi, Koji Honna | 1999-09-14 |