Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10236231 | Semiconductor device | Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more | 2019-03-19 |
| 10134710 | Semiconductor package | Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more | 2018-11-20 |
| 9635762 | Semiconductor package | Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Hiroshi Demachi, Tomoshige Chikai +8 more | 2017-04-25 |
| 9601450 | Semiconductor package | Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more | 2017-03-21 |
| 9368474 | Manufacturing method for semiconductor device | Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hirokazu Honda +8 more | 2016-06-14 |
| 9362200 | Heat sink in the aperture of substrate | Hirokazu Honda, Shinji Watanabe, Toshihiro Iwasaki, Kiminori Ishido, Koichiro Niwa +6 more | 2016-06-07 |