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Semiconductor device |
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2019-03-19 |
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Semiconductor package |
Takeshi Miyakoshi, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more |
2018-11-20 |
| 9635762 |
Semiconductor package |
Shinji Watanabe, Shingo Nakamura, Hiroshi Demachi, Takeshi Miyakoshi, Tomoshige Chikai +8 more |
2017-04-25 |
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Semiconductor package |
Takeshi Miyakoshi, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara +1 more |
2017-03-21 |
| 9368474 |
Manufacturing method for semiconductor device |
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2016-06-14 |
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Heat sink in the aperture of substrate |
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2016-06-07 |
| 7476811 |
Semiconductor device and manufacturing method therefor |
Yoshihiro Kubota, Kazuto Tsuji |
2009-01-13 |
| 7361980 |
Semiconductor device |
Kazuto Tsuji, Yoshihiro Kubota |
2008-04-22 |
| 7193320 |
Semiconductor device having a heat spreader exposed from a seal resin |
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2007-03-20 |
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Semiconductor device |
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2006-05-09 |
| 6796024 |
Method for making semiconductor device |
Yoshitsugu Katoh, Mitsuo Abe, Yoshihiko Ikemoto |
2004-09-28 |
| 6559536 |
Semiconductor device having a heat spreading plate |
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2003-05-06 |
| 6424032 |
Semiconductor device having a power supply ring and a ground ring |
Yoshihiko Ikemoto, Mitsuo Abe, Yoshitsugu Katoh |
2002-07-23 |