Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923835 | Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing | Yoshihiro Kubota, Shirou Youda | 2011-04-12 |
| 7476811 | Semiconductor device and manufacturing method therefor | Yoshihiro Kubota, Sumikazu Hosoyamada | 2009-01-13 |
| 7361980 | Semiconductor device | Sumikazu Hosoyamada, Yoshihiro Kubota | 2008-04-22 |
| 7193320 | Semiconductor device having a heat spreader exposed from a seal resin | Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Masaharu Minamizawa, Toshio Hamano +3 more | 2007-03-20 |
| 7144754 | Device having resin package and method of producing the same | Yoshiyuki Yoneda, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera +1 more | 2006-12-05 |
| 7042102 | Semiconductor device | Yoshihiro Kubota, Kenji Asada, Sumikazu Hosoyamada | 2006-05-09 |
| 6856017 | Device having resin package and method of producing the same | Yoshiyuki Yoneda, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera +1 more | 2005-02-15 |
| 6798031 | Semiconductor device and method for making the same | Toshiyuki Honda, Masanori Onodera, Hiroshi Aoki, Izumi Kobayashi, Susumu Moriya +1 more | 2004-09-28 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2004-02-24 |
| 6573121 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Junichi Kasai, Toshimi Kawahara +3 more | 2003-06-03 |
| 6495773 | Wire bonded device with ball-shaped bonds | Ryuji Nomoto, Mitsutaka Sato, Junichi Kasai | 2002-12-17 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2002-10-29 |
| 6376921 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Junichi Kasai, Toshimi Kawahara +3 more | 2002-04-23 |
| 6271583 | Semiconductor device having resin encapsulated package structure | Hideharu Sakoda, Yoshiyuki Yoneda | 2001-08-07 |
| 6255740 | Semiconductor device having a lead portion with outer connecting terminals | Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo +2 more | 2001-07-03 |
| 6191494 | Semiconductor device and method of producing the same | Nobuo Ooyama, Shinichiro Maki, Fumitoshi Fujisaki, Syunichi Kuramoto, Yukio Saigo +4 more | 2001-02-20 |
| 6159770 | Method and apparatus for fabricating semiconductor device | Masafumi Tetaka, Shinichiro Maki, Nobuo Ohyama, Seiichi Orimo, Hideharu Sakoda +8 more | 2000-12-12 |
| 6072239 | Device having resin package with projections | Yoshiyuki Yoneda, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera +1 more | 2000-06-06 |
| 6069408 | Semiconductor device and method of manufacturing semiconductor device | Toshiyuki Honda, Akihiro Oku, Takanori Watanabe, Yoshiyuki Yoneda | 2000-05-30 |
| 6025650 | Semiconductor device including a frame terminal | Yoshiyuki Yoneda, Hideharu Sakoda, Ryuuji Nomoto, Eiji Watanabe, Seiichi Orimo +2 more | 2000-02-15 |
| 5930603 | Method for producing a semiconductor device | Yoshiyuki Yoneda, Seiichi Orimo, Ryuji Nomoto, Masanori Onodera, Hideharu Sakoda | 1999-07-27 |
| 5904506 | Semiconductor device suitable for testing | Yoshiyuki Yoneda | 1999-05-18 |
| 5891758 | Semiconductor device and method for manufacturing semiconductor device | Toshiyuki Honda, Akihiro Oku, Takanori Watanabe, Yoshiyuki Yoneda | 1999-04-06 |
| 5861669 | Semiconductor package for surface mounting | Michio Sono, Junichi Kasai, Masanori Yoshimoto, Kouji Saito | 1999-01-19 |
| 5842628 | Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method | Ryuji Nomoto, Mitsutaka Sato, Junichi Kasai | 1998-12-01 |