Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923835 | Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing | Yoshihiro Kubota, Kazuto Tsuji | 2011-04-12 |
| 6013944 | Semiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative board | Susumu Moriya, Norio Fukasawa | 2000-01-11 |