Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9076789 | Semiconductor device having a high frequency external connection electrode positioned within a via hole | Yoshitaka Aiba, Tetsuya Fujisawa | 2015-07-07 |
| 9041186 | Encapsulated semiconductor chips with wiring including controlling chip and method of making the same | Ryuji Nomoto, Koichi Nakamura | 2015-05-26 |
| 8759119 | Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2014-06-24 |
| 8404496 | Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2013-03-26 |
| 8097954 | Adhesive layer forming a capacitor dielectric between semiconductor chips | Kaname Ozawa, Mitsutaka Sato | 2012-01-17 |
| 7754534 | Semiconductor device and manufacturing method thereof | Nobukatsu Saito, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi +2 more | 2010-07-13 |
| 7251801 | Method of designing circuit board | Kaname Ozawa, Mitsutaka Sato, Tetsuya Fujisawa, Ryuji Nomoto, Yoshitaka Aiba | 2007-07-31 |
| 7144754 | Device having resin package and method of producing the same | Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera +1 more | 2006-12-05 |
| 7112889 | Semiconductor device having an alignment mark formed by the same material with a metal post | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2006-09-26 |
| 6995044 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Masaharu Minamizawa, Nobutaka Shimizu, Atsushi Kikuchi | 2006-02-07 |
| 6905951 | Method of forming a device substrate and semiconductor package including a pyramid contact | Masaharu Minamizawa, Eiji Watanabe, Mitsutaka Sato | 2005-06-14 |
| 6875638 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaru Nukiwa +6 more | 2005-04-05 |
| 6856017 | Device having resin package and method of producing the same | Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera +1 more | 2005-02-15 |
| 6794273 | Semiconductor device and manufacturing method thereof | Nobukatsu Saito, Masaharu Minamizawa, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi +2 more | 2004-09-21 |
| 6781224 | Semiconductor device and package including forming pyramid mount protruding through silicon substrate | Masaharu Minamizawa, Eiji Watanabe, Mitsutaka Sato | 2004-08-24 |
| 6777250 | Manufacture of wafer level semiconductor device with quality markings on the sealing resin | Shinsuke Nakajyo, Hideharu Sakoda | 2004-08-17 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2004-02-24 |
| 6573121 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai, Toshimi Kawahara +3 more | 2003-06-03 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Norio Fukasawa, Yuzo Hamanaka +2 more | 2003-01-28 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2002-10-29 |
| 6469370 | Semiconductor device and method of production of the semiconductor device | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Norio Fukasawa, Yuzo Hamanaka +2 more | 2002-10-22 |
| 6376921 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai, Toshimi Kawahara +3 more | 2002-04-23 |
| 6329711 | Semiconductor device and mounting structure | Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko +2 more | 2001-12-11 |
| 6271583 | Semiconductor device having resin encapsulated package structure | Hideharu Sakoda, Kazuto Tsuji | 2001-08-07 |
| 6255740 | Semiconductor device having a lead portion with outer connecting terminals | Kazuto Tsuji, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo +2 more | 2001-07-03 |