Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7754534 | Semiconductor device and manufacturing method thereof | Nobukatsu Saito, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi +2 more | 2010-07-13 |
| 7193320 | Semiconductor device having a heat spreader exposed from a seal resin | Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Toshio Hamano +3 more | 2007-03-20 |
| 6995044 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Yoshiyuki Yoneda, Nobutaka Shimizu, Atsushi Kikuchi | 2006-02-07 |
| 6905951 | Method of forming a device substrate and semiconductor package including a pyramid contact | Yoshiyuki Yoneda, Eiji Watanabe, Mitsutaka Sato | 2005-06-14 |
| 6875638 | Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board | Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi, Masaru Nukiwa +6 more | 2005-04-05 |
| 6794273 | Semiconductor device and manufacturing method thereof | Nobukatsu Saito, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi +2 more | 2004-09-21 |
| 6781224 | Semiconductor device and package including forming pyramid mount protruding through silicon substrate | Yoshiyuki Yoneda, Eiji Watanabe, Mitsutaka Sato | 2004-08-24 |
| 6566748 | Flip-chip semiconductor device having an improved reliability | Nobutaka Shimizu, Kazuyuki Imamura, Atsushi Kikuchi | 2003-05-20 |
| 6347037 | Semiconductor device and method of forming the same | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masashi Takenaka, Taturou Yamashita +3 more | 2002-02-12 |
| 6184133 | Method of forming an assembly board with insulator filled through holes | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masashi Takenaka, Taturou Yamashita +1 more | 2001-02-06 |
| 6088233 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masashi Takenaka, Taturou Yamashita +1 more | 2000-07-11 |
| 5978222 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masashi Takenaka, Taturou Yamashita +1 more | 1999-11-02 |
| 5937277 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Tatsuharu Matsuda, Masataka Mizukoshi, Toshiyuki Motooka | 1999-08-10 |
| 5729435 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masashi Takenaka, Taturou Yamashita +1 more | 1998-03-17 |
| 5666270 | Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode | Tatsuharu Matsuda | 1997-09-09 |
| 5637535 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Tatsuharu Matsuda, Masataka Mizukoshi, Toshiyuki Motooka | 1997-06-10 |
| 5607877 | Projection-electrode fabrication method | Tatsuharu Matsuda | 1997-03-04 |