Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6347037 | Semiconductor device and method of forming the same | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +3 more | 2002-02-12 |
| 6184133 | Method of forming an assembly board with insulator filled through holes | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 2001-02-06 |
| 6088233 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 2000-07-11 |
| 5978222 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 1999-11-02 |
| 5889333 | Semiconductor device and method for manufacturing such | Masashi Takenaka, Junichi Kasai, Masataka Mizukoshi | 1999-03-30 |
| 5729435 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 1998-03-17 |
| 5726493 | Semiconductor device and semiconductor device unit having ball-grid-array type package structure | Masashi Takenaka | 1998-03-10 |