MT

Masashi Takenaka

Fujitsu Limited: 20 patents #1,402 of 24,456Top 6%
FL Fujitsu Automation Limited: 4 patents #7 of 36Top 20%
KL Kyushu Fujitsu Electronics Limited: 4 patents #14 of 75Top 20%
SO Socionext: 2 patents #127 of 541Top 25%
FL Fujitsu Microelectronics Limited: 1 patents #212 of 624Top 35%
📍 Tachikawa, JP: #34 of 482 inventorsTop 8%
Overall (All Time): #184,982 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
9355974 Semiconductor device and manufacturing method therefor Katsuyoshi Yamamoto 2016-05-31
9142516 Semiconductor device and manufacturing method therefor Katsuyoshi Yamamoto 2015-09-22
7564111 Imaging apparatus Koji Sawahata, Susumu Moriya, Hiroshi Aoki, Izumi Kobayashi, Toshiyuki Honda +1 more 2009-07-21
7193320 Semiconductor device having a heat spreader exposed from a seal resin Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Masaharu Minamizawa +3 more 2007-03-20
6881611 Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device Norio Fukasawa, Toshimi Kawahara, Muneharu Morioka, Mitsunada Osawa, Yasuhiro Shinma +6 more 2005-04-19
6347037 Semiconductor device and method of forming the same Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Taturou Yamashita +3 more 2002-02-12
6342729 Tape carrier package Shiro Yoda, Junichiro Hiyoshi, Hiroshi Takahashi, Hideo Sato 2002-01-29
6268645 Semiconductor device Shiro Yoda, Junichiro Hiyoshi, Hiroshi Takahashi, Hideo Sato 2001-07-31
6184133 Method of forming an assembly board with insulator filled through holes Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Taturou Yamashita +1 more 2001-02-06
6088233 Semiconductor device and assembly board having through-holes filled with filling core Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Taturou Yamashita +1 more 2000-07-11
5978222 Semiconductor device and assembly board having through-holes filled with filling core Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Taturou Yamashita +1 more 1999-11-02
5920117 Semiconductor device and method of forming the device Michio Sono, Masanori Yoshimoto, Tsuyoshi Aoki, Ichiro Yamaguchi, Koki Otake 1999-07-06
5889333 Semiconductor device and method for manufacturing such Junichi Kasai, Masataka Mizukoshi, Taturou Yamashita 1999-03-30
5831441 Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device Toshiyuki Motooka, Syuichirou Takahasi, Tatsuharu Matsuda, Kunio Kodama, Joji Fujimori +3 more 1998-11-03
5750421 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more 1998-05-12
5736428 Process for manufacturing a semiconductor device having a stepped encapsulated package Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more 1998-04-07
5729435 Semiconductor device and assembly board having through-holes filled with filling core Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Taturou Yamashita +1 more 1998-03-17
5726493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure Taturou Yamashita 1998-03-10
5666064 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more 1997-09-09
5659200 Semiconductor device having radiator structure Michio Sono, Kouji Saito, Masanori Yoshimoto 1997-08-19
5656864 Semiconductor device having upper and lower package bodies and manufacturing method thereof Hiroyuki Mitsue, Masao Sakuma 1997-08-12
5475259 Semiconductor device and carrier for carrying semiconductor device Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more 1995-12-12
5444025 Process for encapsulating a semiconductor package having a heat sink using a jig Michio Sono, Kouji Saito, Masanori Yoshimoto 1995-08-22