Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428074 | Vehicle front portion structure | — | 2025-09-30 |
| 11377152 | Vehicle rear portion structure | Kosei Ota | 2022-07-05 |
| 11104382 | Vehicle rear structure | Takahiro Momose | 2021-08-31 |
| 11097778 | Vehicle rear structure | — | 2021-08-24 |
| 10518809 | Vehicle rear structure | Kazuhiro Kitagawa | 2019-12-31 |
| 8610681 | Information processing apparatus and information processing method | Hideaki Imai, Junichi Kosaka, Yoshihiro Mashiko, Hironobu Aoki | 2013-12-17 |
| 5920117 | Semiconductor device and method of forming the device | Michio Sono, Masashi Takenaka, Tsuyoshi Aoki, Ichiro Yamaguchi, Koki Otake | 1999-07-06 |
| 5861669 | Semiconductor package for surface mounting | Michio Sono, Junichi Kasai, Kazuto Tsuji, Kouji Saito | 1999-01-19 |
| 5831332 | Semiconductor package for surface mounting | Michio Sono, Junichi Kasai, Kazuto Tsuji, Kouji Saito | 1998-11-03 |
| 5786985 | Semiconductor device and semiconductor device unit | Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Michio Sono, Katsuhiro Hayashida +5 more | 1998-07-28 |
| 5728601 | Process for manufacturing a single in-line package for surface mounting | Mitsutaka Sato | 1998-03-17 |
| 5684675 | Semiconductor device unit having holder | Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Michio Sono | 1997-11-04 |
| 5659200 | Semiconductor device having radiator structure | Michio Sono, Kouji Saito, Masashi Takenaka | 1997-08-19 |
| 5637915 | Semiconductor device affixed to an upper and a lower leadframe | Mitsutaka Sato, Junichi Kasai, Kouichi Takeshita | 1997-06-10 |
| 5574310 | Semiconductor package for surface mounting with reinforcing members on support legs | Michio Sono, Junichi Kasai, Kazuto Tsuji, Kouji Saito | 1996-11-12 |
| 5446317 | Single in-line package for surface mounting | Mitsutaka Sato | 1995-08-29 |
| 5444025 | Process for encapsulating a semiconductor package having a heat sink using a jig | Michio Sono, Kouji Saito, Masashi Takenaka | 1995-08-22 |
| 5409866 | Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe | Mitsutaka Sato, Junichi Kasai, Kouichi Takeshita | 1995-04-25 |
| 5343615 | Semiconductor device and a process for making same having improved leads | Michio Sono, Akihiro Kubota, Junichi Kasai, Keiichi Masaki | 1994-09-06 |
| 5305179 | Surface-mounting type semiconductor package having an improved efficiency for heat dissipation | Michio Sono, Junichi Kasai, Kouji Saito, Kazuhiko Mitobe | 1994-04-19 |
| 5293064 | Lead frame and method of manufacturing a semiconductor device | Kazuto Tsuji, Masao Sakuma, Kouichi Takeshita | 1994-03-08 |