Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11898016 | Master batch, polycarbonate resin composition, injection foam molded body and method for producing same | Soichi Uchida, Kazunori Saegusa | 2024-02-13 |
| 8664338 | Processability improver for foam molding and vinyl chloride resin composition containing same | Hideyuki Sakamoto, Hiroomi Tokimoto | 2014-03-04 |
| 8564975 | AC-DC converter | Makoto Sato | 2013-10-22 |
| D675896 | Knife | — | 2013-02-12 |
| 8178619 | (Meth) acrylic polymer and vinyl chloride resin composition containing the same | Yasushi Nakanishi | 2012-05-15 |
| 8097954 | Adhesive layer forming a capacitor dielectric between semiconductor chips | Kaname Ozawa, Yoshiyuki Yoneda | 2012-01-17 |
| 7759246 | Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same | Hirohisa Matsuki, Yoshitaka Aiba, Tadahiro Okamato | 2010-07-20 |
| 7692294 | Semiconductor device and method for fabricating the same | Yoshitsugu Katoh, Tetsuya Fujisawa, Eiji Yoshida | 2010-04-06 |
| 7251801 | Method of designing circuit board | Kaname Ozawa, Tetsuya Fujisawa, Yoshiyuki Yoneda, Ryuji Nomoto, Yoshitaka Aiba | 2007-07-31 |
| 7084513 | Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same | Hirohisa Matsuki, Yoshitaka Aiba, Tadahiro Okamato | 2006-08-01 |
| 7064645 | Electronic device | Kazuhiko Kobayashi, Hideharu Sakoda, Hirohisa Matsuki, Osamu Igawa, Koju Aoki +1 more | 2006-06-20 |
| 6967399 | Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal | Yoshitaka Aiba | 2005-11-22 |
| 6909181 | Light signal processing system | Yoshitaka Aiba, Hirohisa Matsuki | 2005-06-21 |
| 6905951 | Method of forming a device substrate and semiconductor package including a pyramid contact | Yoshiyuki Yoneda, Masaharu Minamizawa, Eiji Watanabe | 2005-06-14 |
| 6836025 | Semiconductor device configured to be surface mountable | Tetsuya Fujisawa, Hirohisa Matsuki, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo | 2004-12-28 |
| 6784543 | External connection terminal and semiconductor device | Hirohisa Matsuki, Yutaka Makino, Masamitsu Ikumo, Tetsuya Fujisawa, Yoshitaka Aiba | 2004-08-31 |
| 6781224 | Semiconductor device and package including forming pyramid mount protruding through silicon substrate | Yoshiyuki Yoneda, Masaharu Minamizawa, Eiji Watanabe | 2004-08-24 |
| 6723762 | Foamable vinyl chloride-base resin compositions | Takenobu Sunagawa, Noriko Sakashita, Mamoru Kadokura | 2004-04-20 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara, Toshio Hamano +5 more | 2004-02-24 |
| 6635687 | Expandable vinyl chloride resin composition | Takenobu Sunagawa, Mamoru Kadokura | 2003-10-21 |
| 6627479 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer | Yoshitaka Aiba, Toshio Hamano | 2003-09-30 |
| 6610757 | Foamable vinyl chloride resin composition | Takenobu Sunagawa, Noriko Sakashita, Mamoru Kadokura | 2003-08-26 |
| 6586273 | Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal | Yoshitaka Aiba | 2003-07-01 |
| 6548898 | External connection terminal and semiconductor device | Hirohisa Matsuki, Yutaka Makino, Masamitsu Ikumo, Tetsuya Fujisawa, Yoshitaka Aiba | 2003-04-15 |
| 6495773 | Wire bonded device with ball-shaped bonds | Ryuji Nomoto, Kazuto Tsuji, Junichi Kasai | 2002-12-17 |