Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004817 | Semiconductor device and method for manufacturing the same | — | 2021-05-11 |
| 9893029 | Semiconductor device and method for manufacturing the same | — | 2018-02-13 |
| 8994153 | Semiconductor device having antenna element and method of manufacturing same | Masao Sakuma | 2015-03-31 |
| 8952538 | Semiconductor device and method for manufacturing the same | — | 2015-02-10 |
| 8759119 | Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2014-06-24 |
| 8490857 | Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device | Hiroyuki Matsui, Koki Otake | 2013-07-23 |
| 8404496 | Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2013-03-26 |
| 8395260 | Semiconductor device and manufacturing method thereof | Jun Fukuda | 2013-03-12 |
| 8336756 | Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device | Hiroyuki Matsui, Koki Otake | 2012-12-25 |
| 8084277 | Semiconductor device and manufacturing method thereof | Jun Fukuda | 2011-12-27 |
| 7863745 | Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device | Ryuji Nomoto | 2011-01-04 |
| 7759246 | Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same | Yoshitaka Aiba, Mitsutaka Sato, Tadahiro Okamato | 2010-07-20 |
| 7556985 | Method of fabricating semiconductor device | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2009-07-07 |
| 7550844 | Semiconductor device and manufacturing method thereof | Jun Fukuda | 2009-06-23 |
| 7405137 | Method of dicing a semiconductor substrate into a plurality of semiconductor chips by forming two cutting grooves on one substrate surface and forming one cutting groove on an opposite substrate surface that overlaps the two cutting grooves | Satoshi Terayama | 2008-07-29 |
| 7240432 | Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece | Shigeyuki Maruyama | 2007-07-10 |
| 7233076 | Semiconductor device with read out prevention and method of producing same | Masamitsu Ikumo | 2007-06-19 |
| 7112889 | Semiconductor device having an alignment mark formed by the same material with a metal post | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2006-09-26 |
| 7084513 | Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same | Yoshitaka Aiba, Mitsutaka Sato, Tadahiro Okamato | 2006-08-01 |
| 7064436 | Semiconductor device and method of fabricating the same | Masahiko Ishiguri, Hiroyuki Yoda, Tadahiro Okamoto, Masamitsu Ikumo, Shuichi Chiba | 2006-06-20 |
| 7064047 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2006-06-20 |
| 7064645 | Electronic device | Kazuhiko Kobayashi, Hideharu Sakoda, Osamu Igawa, Mitsutaka Sato, Koju Aoki +1 more | 2006-06-20 |
| 6987054 | Method of fabricating a semiconductor device having a groove formed in a resin layer | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2006-01-17 |
| 6939142 | Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece | Shigeyuki Maruyama | 2005-09-06 |
| 6909181 | Light signal processing system | Yoshitaka Aiba, Mitsutaka Sato | 2005-06-21 |