Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915538 | Multilayer wiring board and its manufacturing method | Masamitsu Ikumo, Eiji Watanabe | 2011-03-29 |
| 7754534 | Semiconductor device and manufacturing method thereof | Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura +2 more | 2010-07-13 |
| 7723847 | Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween | Yutaka Makino, Takaki Kurita | 2010-05-25 |
| 7355124 | Multilayer wiring board and its manufacturing method | Masamitsu Ikumo, Eiji Watanabe | 2008-04-08 |
| 7064436 | Semiconductor device and method of fabricating the same | Masahiko Ishiguri, Hirohisa Matsuki, Hiroyuki Yoda, Masamitsu Ikumo, Shuichi Chiba | 2006-06-20 |
| 6794273 | Semiconductor device and manufacturing method thereof | Nobukatsu Saito, Masaharu Minamizawa, Yoshiyuki Yoneda, Nobutaka Shimizu, Kazuyuki Imamura +2 more | 2004-09-21 |
| 6680241 | Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | Hirohisa Matsuki | 2004-01-20 |
| 4787951 | Method and apparatus for adhering a tape or sheet to a semiconductor wafer | — | 1988-11-29 |