Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Norio Fukasawa, Toshimi Kawahara, Muneharu Morioka, Mitsunada Osawa, Yasuhiro Shinma +6 more | 2005-04-19 |
| 6836025 | Semiconductor device configured to be surface mountable | Tetsuya Fujisawa, Osamu Igawa, Yoshitaka Aiba, Masamitsu Ikumo, Mitsutaka Sato | 2004-12-28 |
| 6784542 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2004-08-31 |
| 6784543 | External connection terminal and semiconductor device | Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba | 2004-08-31 |
| 6734042 | Semiconductor device and method for fabricating the same | Masamitsu Ikumo | 2004-05-11 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake, Akiyo Mizutani +3 more | 2004-05-11 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2004-02-24 |
| 6680241 | Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | Tadahiro Okamoto | 2004-01-20 |
| 6666369 | Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment | Hiroyuki Matsui | 2003-12-23 |
| 6657282 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2003-12-02 |
| 6566239 | Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating | Yutaka Makino, Eiji Watanabe, Tetsuya Fujisawa | 2003-05-20 |
| 6548898 | External connection terminal and semiconductor device | Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba | 2003-04-15 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Toshimi Kawahara, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2003-01-28 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2002-10-29 |
| 6471501 | Mold for fabricating semiconductor devices | Yasuhiro Shinma, Muneharu Morioka, Norio Fukasawa, Yuzo Hamanaka, Tadashi Uno +1 more | 2002-10-29 |
| 6469370 | Semiconductor device and method of production of the semiconductor device | Toshimi Kawahara, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2002-10-22 |
| 6455920 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2002-09-24 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Fumihiko Taniguchi, Kunio Kodama, Eiji Watanabe, Masataka Mizukoshi, Hiroyuki Matsui | 2002-02-05 |
| 6232147 | Method for manufacturing semiconductor device with pad structure | Kenichi Kado, Eiji Watanabe, Kazuyuki Imamura, Takahiro Yurino | 2001-05-15 |
| 6218281 | Semiconductor device with flip chip bonding pads and manufacture thereof | Eiji Watanabe, Kenichi Kado, Kenichi Nagashige, Masanori Onodera, Kunio Kodama +4 more | 2001-04-17 |
| 5969424 | Semiconductor device with pad structure | Kenichi Kado, Eiji Watanabe, Kazuyuki Imamura, Takahiro Yurino | 1999-10-19 |
| 5633532 | Semiconductor device interconnection | Tuyosi Sohara, Toshiyuki Kuramochi | 1997-05-27 |
| 5065223 | Packaged semiconductor device | Shigeki Harada, Masahiro Sugimoto, Toshiki Yoshida | 1991-11-12 |