Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Norio Fukasawa, Toshimi Kawahara, Muneharu Morioka, Yasuhiro Shinma, Hirohisa Matsuki +6 more | 2005-04-19 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2004-02-24 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2002-10-29 |
| 6379997 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mayumi Osumi, Hiroyuki Ishiquro, Yoshitugu Katoh +3 more | 2002-04-30 |
| 6111306 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mayumi Osumi, Hiroyuki Ishiguro, Yoshitugu Katoh +3 more | 2000-08-29 |
| 6034428 | Semiconductor integrated circuit device having stacked wiring and insulating layers | Toshimi Kawahara, Hiroyuki Ishiguro, Shinichirou Taniguchi, Mayumi Osumi, Shinya Nakaseko +2 more | 2000-03-07 |
| 5844309 | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition | Yukio Takigawa, Shigeaki Yagi, Toshimi Kawahara, Hiroyuki Ishiguro, Shinya Nakaseko +2 more | 1998-12-01 |
| 5804467 | Semiconductor device and method of producing the same | Toshimi Kawahara, Shinya Nakaseko, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1998-09-08 |
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Toshimi Kawahara, Shinya Nakaseko, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1997-10-21 |
| 5226582 | Method for wire-bonding an integrated circuit | Akihiro Kubota | 1993-07-13 |