Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7186575 | Manufacturing method of semiconductor device | Daisuke Ito | 2007-03-06 |
| 6881611 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Norio Fukasawa, Muneharu Morioka, Mitsunada Osawa, Yasuhiro Shinma, Hirohisa Matsuki +6 more | 2005-04-19 |
| 6774650 | Probe card and method of testing wafer having a plurality of semiconductor devices | Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida +2 more | 2004-08-10 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshio Hamano +5 more | 2004-02-24 |
| 6656996 | Semiconductor-sealing resin composition and semiconductor device using it | Yasuaki Tsutsumi, Tetsuya Mieda, Masayuki Tanaka, Yukio Takigawa | 2003-12-02 |
| 6573121 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai +3 more | 2003-06-03 |
| 6563330 | Probe card and method of testing wafer having a plurality of semiconductor devices | Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida +2 more | 2003-05-13 |
| 6541848 | Semiconductor device including stud bumps as external connection terminals | Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi | 2003-04-01 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2003-01-28 |
| 6507092 | Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same | Norio Fukasawa, Takashi Hozumi | 2003-01-14 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshio Hamano +5 more | 2002-10-29 |
| 6469370 | Semiconductor device and method of production of the semiconductor device | Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2002-10-22 |
| 6437432 | Semiconductor device having improved electrical characteristics and method of producing the same | Masamitsu Ikumo, Norio Fukasawa, Kenichi Nagashige | 2002-08-20 |
| 6379997 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiquro, Yoshitugu Katoh +3 more | 2002-04-30 |
| 6376921 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai +3 more | 2002-04-23 |
| 6361879 | Semiconductor device and method for fabricating it, and semiconductor sealing resin composition | Yasuaki Tsutsumi, Masayuki Tanaka, Yukio Takigawa | 2002-03-26 |
| 6329711 | Semiconductor device and mounting structure | Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi +2 more | 2001-12-11 |
| 6207477 | Semiconductor device having a ball grid array and a fabrication process thereof | Toshiyuki Motooka, Yoshiyuki Yoneda, Ryuji Nomoto, Junichi Kasai | 2001-03-27 |
| 6111306 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiguro, Yoshitugu Katoh +3 more | 2000-08-29 |
| 6034428 | Semiconductor integrated circuit device having stacked wiring and insulating layers | Hiroyuki Ishiguro, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Shinya Nakaseko +2 more | 2000-03-07 |
| 5844309 | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition | Yukio Takigawa, Shigeaki Yagi, Mitsunada Osawa, Hiroyuki Ishiguro, Shinya Nakaseko +2 more | 1998-12-01 |
| 5804467 | Semiconductor device and method of producing the same | Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1998-09-08 |
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1997-10-21 |
| 5616164 | Methods for making metal particle spherical and removing oxide film solder paste and soldering method | Masayuki Ochiai, Kaoru Hashimoto, Mayumi Osumi | 1997-04-01 |
| 4788583 | Semiconductor device and method of producing semiconductor device | Michio Sono, Hiroaki Hayashi | 1988-11-29 |